Transcription of Micro Structure Observation and Reliability …
{{id}} {{{paragraph}}}
Example: air traffic controller
Micro Structure Observation and Reliability …
73 Orii et al.: Micro Structure Obser vation and Reliability behavior (1/14)[Technical Paper] Micro Structure Obser vation and Reliability behavior of Peripheral Flip Chip Interconnections with Solder-Capped Cu Pillar BumpsYasumitsu Orii*, Kazushige Toriyama*, Sayuri Kohara*, Hirokazu Noma*, Keishi Okamoto*, Daisuke Toyoshima**, and Keisuke Uenishi**IBM Research Tokyo, 1623-14, Shimotsuruma, Yamato-city, Kanagawa-ken 242-8502, Japan**Osaka University, 2-1, Yamadaoka, Suita, Osaka 565-0871, Japan(Received September 1, 2011; accepted November 10, 2011)AbstractPoP (Package on Package) structures have been used widely in digital consumer electronics products such as digital still cameras and mobile phones. However, the final stack height from the top to the bottom package for these structures is higher than that of the current stacked die packages.
75 Orii et al.: Micro Structure Observation and Reliability Behavior (3/14) chip die and SMT component joints are formed in a single reflow step. After a …
Loading..
Tags:
Information
Domain:
Source:
Link to this page:
Please notify us if you found a problem with this document: