Microelectronics Reliability: Physics-of-Failure Based ...

National Aeronautics and Space Administration Microelectronics Reliability: Physics-of-Failure Based Modeling and Lifetime Evaluation Mark White Jet Propulsion Laboratory Pasadena, California Joseph B. Bernstein University of Maryland College Park, Maryland Jet Propulsion Laboratory California Institute of Technology Pasadena, California JPL Publication 08-5 2/08. National Aeronautics and Space Administration Microelectronics Reliability: Physics-of-Failure Based Modeling and Lifetime Evaluation NASA electronic Parts and Packaging (NEPP) Program Office of Safety and Mission Assurance Mark White Jet Propulsion Laboratory Pasadena, California Joseph B. Bernstein University of Maryland College Park, Maryland NASA WBS: JPL Project Number: 102197. Task Number: Jet Propulsion Laboratory 4800 Oak Grove Drive Pasadena, CA 91109. This research was primarily carried out at the University of Maryland under the direction of Professor Joseph B. Bernstein and was sponsored in part by the National Aeronautics and Space Administration electronic Parts and Packaging (NEPP) Program, the Aerospace Vehicle Systems Institute (AVSI) Consortium specifically, AVSI Project #17: Methods to Account for Accelerated Semiconductor Wearout and the Office of Naval Research.

The solid-state electronics industry faces relentless pressure to improve performance, increase functionality, decrease costs, and reduce design and development time. As a result, device feature sizes are now in the nanometer scale range and design life cycles have decreased to fewer than five years.

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