Transcription of Pad Layouts/Soldering Process - Vishay Intertechnology
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Pad Layouts/Soldering Process - Vishay Intertechnology
Pad Layouts/Soldering General Semiconductor Revision: 12-Sep-131 Document Number: 88854 For technical questions within your region: DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENTARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT Layouts/Soldering ProcessVISHAY GENERAL SEMICONDUCTOR RECOMMENDED MINIMUM MOUNTING PAD layout SIZES FOR THE SURFACE MOUNT ( ) ( ) ( ) ( ) ( ) ( ) ( ) ( ) ( )DFS ( ) ( ) ( ) ( ) ( ) ( ) ( ) ( ) ( ) ( ) ( ) ( ) ( )TO-277A (SMPC) ( ) ( ) ( ) ( ) ( ) ( ) ( ) ( ) ( ) ( ) (GL34)/DO-213AB (GL-41)DO-220AA (SMP) ( ) ( ) ( ) ( ) ( ) All dimensions in inches (millimeters) ( ) ( ) ( ) ( ) (SMA)/DO-214BA (GF1)MBS ( ) ( ) ( ) ( ) ( )MBLS ( ) ( ) ( ) ( ) ( )DO-214AA (SMB)DO-214AB (SMC)Pad Layouts/Soldering General Semiconductor Revision.
Pad Layouts/Soldering Process www.vishay.com Vishay General Semiconductor Revision: 12-Sep-13 2 Document Number: 88854 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
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