Transcription of PCB Assembly Guidelines for 0.4mm Package-On-Package …
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PCB Assembly Guidelines for 0.4mm Package-On-Package …
ApplicationReportSPRAAV2A November2013 PCBA ssemblyGuidelinesfor (PoP) packages ,PartIIKeithGutierrezand GeraldColeyABSTRACTO ncethe bottomcircuitboardhas beendesigned,the assemblyguidelinesfor Package-On-Package (PoP)versionsof the OMAP35xxprocessorand the memorydevicemustbe enormousnumberof variablesassociatedwith followingfactorshavea majoreffecton the qualityand reliabilityof finalassembly:the circuitboarddesign,the solderpastecharacteristics,solderpastede position,the reflowprofile,and the fluxingor solderpastedepositionontothe PoP memorypriorto two majortechniquesfor mountingthe PoP memory:one passand two ,the one passprocessis recommendedas it is the mosteconomicaland providesaboutthesameassemblyyieldsas the two BeagleBoard,discussedin the companionarticleto this document,PCBD esignGuidelinesfor (PoP) packages (SPRAAV1) - whichwill be referredto as PartI throughoutthereminderof this document- formsthe basisfor the understandingof applicationreportdescri
Application Report SPRAAV2A–November 2013 PCB Assembly Guidelines for 0.4mm Package-On-Package (PoP) Packages, Part II Keith Gutierrez and Gerald Coley
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