Transcription of Product Overview Heraeus Electronics – Assembly Materials ...
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Product Overview Heraeus Electronics – Assembly Materials ...
Product Overview Heraeus Electronics Assembly Materials Power & Discrete Introduction Content Introduction 02. mAgic Sinter Materials 03. Solder Wires for Die Attach 04. Solder Pastes for Die and Clip Attach 05. Solder Pastes for Bumping 06. Fluxes and SmartFluxes for Ball and Flip Chip Attach 07. Water Soluble Solder Pastes for System in Package (SiP) 08. Adhesives for Die Attach 09. Solder Pastes for Direct Copper Bonding (DCB) 10. Welco Ultra Fine Solder Powder . 11. The Global Business Unit, Heraeus Electronics Assembly Materials is the premier manufacturer of Materials for semiconductor Assembly / packaging and printed circuit boards. The business focus is on 3 distinct but related Product segments: n A utomotive and Industrial Materials for PCB Assembly of high reliability electronic circuits n Power and Discrete Materials for Assembly / packaging of Semi- conductors and related technologies n Powder Vertically integrated manufacture of Solder Powders for every application (Low Alpha, Lead free , Wafer Bumping, etc.)
mAgic Sinter Materials Heraeus Lead Free Die Attach Technology As a leading supplier of Die Attach materials to the power electronics market Heraeus recognized the ...
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