Transcription of Sectional Design Standard for Rigid Organic …
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IPC-2222 Sectional Design Standard forRigid Organic printed BoardsASSOCIATION CONNECTINGELECTRONICS INDUSTRIES2215 Sanders Road, Northbrook, IL 60062-6135 Tel. Fax 1998A Standard developed by IPCS upersedes IPC-D-275 September 1991 FOREWORDThis Standard is intended to provide information on the detailed requirements for Organic Rigid printed board Design . Allaspects and details of the Design requirements are addressed to the extent that they can be applied to the unique require-ments of those designs that use Organic Rigid (reinforced) materials or Organic materials in combination with inorganic mate-rials (metal, glass, ceramic, etc.) to provide the structure for mounting and interconnecting electronic, electromechanical, andmechanical information contained herein is intended to supplement generic engineering considerations and Design requirementsidentified in IPC-2221.
IPC-2222 Sectional Design Standard for Rigid Organic Printed Boards ASSOCIATION CONNECTING ELECTRONICS INDUSTRIES 2215 Sanders Road, Northbrook, IL 60062-6135
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Controlling Moisture in Printed Circuit Boards, Specification for Base Materials for, Specification for Base Materials for Rigid and Multilayer Printed Boards, Partner for High Performance Laminate, Partner for High Performance Laminate & Masslam Service, Glossary, PRODUCT DEVELOPMENT FOR OUT- OF, PRODUCT DEVELOPMENT FOR OUT-OF-AUTOCLAVE, Specification for Base Materials for, SUPPLIER QUALITY AGREEMENT