Transcription of Specification for Base Materials for Rigid and …
{{id}} {{{paragraph}}}
IPC-4101 Specification for BaseMaterials for Rigid andMultilayer printed BoardsASSOCIATION CONNECTINGELECTRONICS INDUSTRIES2215 Sanders Road, Northbrook, IL 60062-6135 Tel. Fax 1997A standard developed by IPCS upersedes IPC-L-108,IPC-L-109, IPC-L-112,IPC-L-115, IPC-AM-361 Table of Specification Sheet Nominal Laminate Metal Cladding Type .. Thickness Tolerance (Laminate) .. Surface Quality Class .. Reinforcement Style .. Prepreg Parameters .. and APPLICABLE Conference of StandardsLaboratories .. Standards .. and Qualification Quality Conformance Manufacturer s Quality Process Control Self Declaration .. Assessment Data .. Test Data .. Assessment .. Customer Audit .. Third Party Quality Testing Laminate.
IPC-4101 Specification for Base Materials for Rigid and Multilayer Printed Boards ASSOCIATION CONNECTING ELECTRONICS INDUSTRIES 2215 Sanders Road, Northbrook, IL 60062-6135
Domain:
Source:
Link to this page:
Please notify us if you found a problem with this document:
{{id}} {{{paragraph}}}
Controlling Moisture in Printed Circuit Boards, Partner for High Performance Laminate, Partner for High Performance Laminate & Masslam Service, Glossary, PRODUCT DEVELOPMENT FOR OUT- OF, PRODUCT DEVELOPMENT FOR OUT-OF-AUTOCLAVE, Sectional Design Standard for Rigid Organic, Sectional Design Standard for Rigid Organic Printed, Specification for Base Materials for, SUPPLIER QUALITY AGREEMENT