Transcription of Controlling Moisture in Printed Circuit Boards - …
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Controlling Moisture in Printed Circuit Boards - …
As originally published in the IPC Printed Circuit Expo, APEX & Designer Summit Proceedings. Controlling Moisture in Printed Circuit Boards Bhanu Sood and Michael Pecht Center for Advanced Life Cycle Engineering (CALCE). University of Maryland, College Park, MD 20742. Abstract Moisture can accelerate various failure mechanisms in Printed Circuit board assemblies. Moisture can be initially present in the epoxy glass prepreg, absorbed during the wet processes in Printed Circuit board manufacturing, or diffuse into the Printed Circuit board during storage. Moisture can reside in the resin, resin/glass interfaces, and micro-cracks or voids due to defects. Higher reflow temperatures associated with lead-free processing increase the vapor pressure, which can lead to higher amounts of Moisture uptake compared to eutectic tin-lead reflow processes.
Controlling Moisture in Printed Circuit Boards . Bhanu Sood and Michael Pecht . Center for Advanced Life Cycle Engineering (CALCE) …
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