Transcription of 低密度実装を可能にする ... - semicon.jeita.or.jp
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低密度実装を可能にする ... - semicon.jeita.or.jp
1 Work in Progress - Do not publishSTRJ WS: March 2, 2012, WG7 ( ) 2011 STRJ 2011 3 2 ( ) STRJ WG7 ( ) 2 Work in Progress - Do not publishSTRJ WS: March 2, 2012, WG7 ( ) 2011 6 2011 7 2012 2 ASET 2011 10 2011 STRJ WG7 3 Work in Progress - Do not publishSTRJ WS: March 2, 2012, WG7 ( )Application(Products)PWBP assiveComponentsDesignTESTI nter-connectLitho PIDS FEP ES&HM&SMET ERD ERM FI AssemblyEquipmentsPackageMEMSS emiconductor Technology Roadmap committee (STRJ)Semiconductor Technology Roadmap committee (STRJ)Japan Jisso Technology Roadmap committee (JJTR)Japan Jisso Technology Roadmap committee (JJTR)JEITAJEITA JJTR WG3 STRJ WG7 SeedsNeedsSTRJ WG7 4 Work in Progress - Do not publishSTRJ WS: March 2, 2012, WG7 ( ) mobilityHarshenvironmentHighHighAutomoti ve electronicsCar navigation CellphoneNote PC Mobile digital imaging Wearable Home digital AV 2011
Work in Progress - Do not publish STRJ WS: March 2, 2012, WG7 (実装) 1 低密度実装を可能にする パッケージ技術 エレクトロニクス実装学会 第1回システムインテグレーション実装技術研究会公開研究会
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