Transcription of Semiconductor and IC Package Thermal Metrics …
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Semiconductor and IC Package Thermal Metrics …
1 SPRA953C December2003 RevisedApril2016 SubmitDocumentationFeedbackCopyright 2003 2016,TexasInstrumentsIncorporatedSemicon ductorand IC PackageThermalMetricsApplicationReportSP RA953C December2003 RevisedApril2016 Semiconductorand IC PackageThermalMetricsDarvinEdwards,HiepN guyenABSTRACTM anythermalmetricsexistfor semiconductorand integratedcircuit(IC) packagesrangingfromR JAto JT. Often,thesethermalmetricsare misappliedby thosewhotry to use themto estimatejunctiontemperaturesin documentdescribestraditionaland new thermalmetricsand puts theirapplicationin perspectivewith respectto JAJunction-to-Ambientand R JT, Junctionto Top of (JB) of Figures11s vs 2s2pPCBfor SizeImpacton a JAvs (JB) of Tables1 FactorsAffectingR JAfor a JTfor a registeredtrademarkof othertrademarksare the propertyof theirrespectiveowners.()TTRP owerJAJA=+ qR JAJunction-to-Ambientand R December2003 RevisedApril2016 SubmitDocumentationFeedbackCopyright 2003 2016,TexasInstrumentsIncorporatedSemicon ductorand IC PackageThermalMetrics1R JAJunction-to-Ambientand R JMAJ unction-to-MovingAirThe junction-to-ambientthermalresistance,R JA, is the mostcommonlyreportedthermalmetricand is JAis a measureof the thermalperformanceof an IC packagemountedon aspecifictest intentof R JAis to give a metricby whichthe relativethermalperformanceof apackag
T T R PowerJ A JA= + ´( q ) RθJA Junction-to-Ambient and RθJMA Junction-to-Moving Air www.ti.com 2 SPRA953C–December 2003–Revised April …
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