Transcription of Semiconductor and IC Package Thermal Metrics …
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1 SPRA953C December2003 RevisedApril2016 SubmitDocumentationFeedbackCopyright 2003 2016,TexasInstrumentsIncorporatedSemicon ductorand IC PackageThermalMetricsApplicationReportSP RA953C December2003 RevisedApril2016 Semiconductorand IC PackageThermalMetricsDarvinEdwards,HiepN guyenABSTRACTM anythermalmetricsexistfor semiconductorand integratedcircuit(IC) packagesrangingfromR JAto JT. Often,thesethermalmetricsare misappliedby thosewhotry to use themto estimatejunctiontemperaturesin documentdescribestraditionaland new thermalmetricsand puts theirapplicationin perspectivewith respectto JAJunction-to-Ambientand R JT, Junctionto Top of (JB) of Figures11s vs 2s2pPCBfor SizeImpacton a JAvs (JB) of Tables1 FactorsAffectingR JAfor a JTfor a registeredtrademarko
0 10 20 30 40 50 60 70 80 dip 20 cu dip 24 cu qfp 100 cu qfp 120 a-42 qfp 132 a-42 qfp 132 c qfp 160 a-42 qfp 208 cu qfp loc 208 + h.s. qfp …
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Corporate Fact Sheet, ON Semiconductor, Semiconductor, FUJITSU SEMICONDUCTOR LIMITED, FUJITSU SEMICONDUCTOR Quality and Reliability Assurance FUJITSU SEMICONDUCTOR LIMITED, VALUING PATENTS AND INTANGIBLE ASSETS IN, VALUING PATENTS AND INTANGIBLE ASSETS IN THE SEMICONDUCTOR, Semiconductor Wafer Edge Analysis