Transcription of Semiconductor and IC Package Thermal Metrics (Rev. C)
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Semiconductor and IC Package Thermal Metrics (Rev. C)
1 SPRA953C December2003 RevisedApril2016 SubmitDocumentationFeedbackCopyright 2003 2016,TexasInstrumentsIncorporatedSemicon ductorand IC PackageThermalMetricsApplicationReportSP RA953C December2003 RevisedApril2016 Semiconductorand IC PackageThermalMetricsDarvinEdwards,HiepN guyenABSTRACTM anythermalmetricsexistfor semiconductorand integratedcircuit(IC) packagesrangingfromR JAto JT. Often,thesethermalmetricsare misappliedby thosewhotry to use themto estimatejunctiontemperaturesin documentdescribestraditionaland new thermalmetricsand puts theirapplicationin perspectivewith respectto JAJunction-to-Ambientand R JT, Junctionto Top of (JB) of Figures11s vs 2s2pPCBfor SizeImpacton a JAvs (JB) of Tables1 FactorsAffectingR JAfor a JTf
5 Installing a Heat Sink With Thermocouple ... Table 1 lists factors that can influence RθJA for a given package outline when all materials are held constant. The first column lists the factor while the second column gives a rule of thumb estimate as to the ... Package Type J/ A (C/W) 0 …
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