Transcription of SMA Application Guideline - passive component
{{id}} {{{paragraph}}}
Example: tourism industry
SMA Application Guideline - passive component
Walsin Technology Corporation Version 03 Page-1 Lead free MLCC, Chip-R, MLCI SMA Application Guideline Walsin Technology Corporation Version 03 Page-2 Background Pb free solder material was started in 1995. A composition of ( ) was announced in July 1998, though, since later it was found that for 42 alloy (most popular material fore lead frame), wetting and joint strength was insufficient and further Life-off problem was newly found, the composition was reviewed and resulted in the present composition. According to the test data shown in that meeting, major components (QFP, Chip-R, MLCC) were tested and significant difference in mechanical strength was not found compared with Sn/Pb solder.
Walsin Technology Corporation HTTP://WWW.PASSIVECOMPONENT.COM Version 03 Page-4 Recommended IR Reflow Soldering Conditions The following Lead free solderpastes are suitable to be applied wit h WTC components :
Loading..
Tags:
Information
Domain:
Source:
Link to this page:
Please notify us if you found a problem with this document:
Related search queries
Free, L ead-Free Soldering Products, Lead-Free Soldering Products, Lead-Free LEAD Soldering Guide, Free soldering, Lead-Free Selective Soldering: The Wave, Soldering, KOA SPEER ELECTRONICS, INC, HAND SOLDERING TRAINING COURSE, Wave Soldering Problems, Pad Layouts/Soldering Process, Vishay Intertechnology, Pad Layouts/Soldering Process www.vishay.com