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SMT Board Assembly Process Guide - Intel

SMT Board Assembly Process Recommendations Intel Manufacturing Enabling Guide March 2016. Intel Manufacturing Enabling Guide March 2016. SMT Board Assembly Process Disclaimers INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH Intel . PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN Intel 'S TERMS AND CONDITIONS OF SALE FOR SUCH. PRODUCTS, Intel ASSUMES NO LIABILITY WHATSOEVER AND Intel DISCLAIMS. ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF Intel . PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A. PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.

parameters differ with solder paste formulation (even if they have the same metal composition), the profile envelope recommended by the solder paste manufacturer should be considered. Reflow Profile Board Preparation Reflow profile measurement is a vital part of setting up reflow the solder conditions.

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