Transcription of Solder Pad Recommendations for Surface-Mount Devices …
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Solder Pad Recommendations for Surface-Mount Devices …
SBFA015A - January 1998 - Revised May 2003 Application PAD Recommendations FORSURFACE- mount DEVICESBy Wm. P. Klein, and performance requirements continue to push thepackaging of electronic systems into smaller and smallerspaces. At one time, the standard center-to-center pin spac-ing was 100 mils ( ") on through-hole parts (DIPs).The advent of Surface-Mount Devices (SMD) has brought pinspacings that differ from one package series to the Solder joint of pin-foot to printed circuit board (PCB) mustprovide the strength to hold the device in place. The closelead spacings make lead-to-lead Solder bridges more preva-lent. These factors increase the importance of an optimizedPCB criteria for a well-designed Solder joint is based on bothempirical data and reliability testing.
SBFA015A - January 1998 - Revised May 2003 Application Report www.ti.com AB-132C SOLDER PAD RECOMMENDATIONS FOR SURFACE-MOUNT DEVICES By Wm. P. Klein, P.E.
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