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Solderability Tests for Component Leads, …
EIA/IPC/JEDEC J-STD-002 DSolderability Testsfor Component Leads, Terminations, lugs ,Terminals and WiresA joint standard developed by IPC Components and Wire SolderabilitySpecification Task Group (5-23b) of the Assembly and Joining ProcessesCommittee (5-20), the Electronic Components Industry AssociationSoldering Technology Committee (STC) and the JEDEC Solid StateTechnology Association Committee ( )Users of this standard are encouraged to participate in thedevelopment of future :EIA StandardsElectronic ComponentsIndustry Association2214 Rock Hill Road, Suite 170 Herndon, VA 20170-4212 Phone: (571) 323-0294 Fax: (571) 323-0245 IPCA ssociation ConnectingElectronics Industries 3000 Lakeside Drive, Suite 309 SBannockburn, IL 60015-1249 Phone: (847) 615-7100 Fax: (847) 615-7105 JEDEC Solid State TechnologyAssociation3103 North 10th Street, Suite 240-SArlington, VA 22201-2107 Phone: (703) 907-7540 F
Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires 1 PREFACE 1.1 Scope This standard prescribes test methods, defect definitions, acceptance criteria, and illustrations for assessing the solderability of electronic component leads, terminations, solid wires, stranded wires, lugs, and tabs.
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002D Solderability Tests for Component, Solderability, Component leads, MIL-STD, Component, Tests, Edition 5.0 2008-07 INTERNATIONAL STANDARD, JEDEC STANDARDS, Componet Relability after long term storage, ELECTROPLATING VERSUS HOT - DIPPED, 4030F Baseline Requirements for Hot Solder, Baseline Requirements for Hot Solder