Transcription of Componet Relability after long term storage
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Componet Relability after long term storage
Application Report May 2008 Trademarks are the property of their respective owners SLVA304 component Reliability after long Term storage R. R. Madsen ABSTRACT Each year the semiconductor industry routes a significant volume of devices to recycling sites for no reliability or quality rationale beyond the fact that those devices were stored on a warehouse shelf for two years. This study identifies the key risks attributed to extended storage of devices in uncontrolled indoor environments and the risk mitigation required to permit safe shelf-life extension. component reliability was evaluated after extended storage to assure component solderability, MSL stability and die surface integrity.
May 2008 5 Component Reliability After Long Term Storage SLVA304 EXCLUSIONS Devices with a NiPdAu lead finish were the primary focus in this evaluation.
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002D Solderability Tests for Component, Solderability, Component leads, Solderability Tests for Component Leads, Solderability Tests for Component Leads, Terminations, Lugs, Terminals, MIL-STD, Component, Tests, Edition 5.0 2008-07 INTERNATIONAL STANDARD, JEDEC STANDARDS, ELECTROPLATING VERSUS HOT - DIPPED, 4030F Baseline Requirements for Hot Solder, Baseline Requirements for Hot Solder