Transcription of Soldering Guidelines for Mounting Bottom …
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Soldering Guidelines for Mounting Bottom …
Soldering Guidelines for Mounting Bottom -terminated ComponentsApplication Note 62 2016, Peregrine Semiconductor Corporation. All rights reserved. Headquarters: 9380 Carroll Park Drive, San Diego, CA, 92121 Application NoteDOC-78164-1 (10/2016) objective of this application note is to provide Peregrine Semiconductor customers with general Guidelines for Soldering and assembly of quad flat pack no leads (QFNs) and other Bottom -terminated components (BTCs). Precise process development and designed experi-mentation are needed to optimize specific are thermally enhanced plastic leadless packages with electrical connections made via lands on the Bottom side of the component to the surface of the connecting substrate (PCB, ceramic, LTCC, etc.)
Application Note 62 Soldering Guidelines for BTCs Page 2 DOC-78164-1 – (10/2016) www.psemi.com PC Board Land Pattern Please refer to the Peregrine datasheet for the recommended land pattern for the package
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