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Stencil Design Guidelines for Electronics Assembly ...
BUDAPEST UNIVERSITY OF TECHNOLOGY AND ECONOMICSDEPARTMENT OF Electronics TECHNOLOGYS tudent professional contest The 22nd Edition, Brasov,24th-27th April 2013 Stencil Design Guidelines forElectronics Assembly TechnologiesREFLOW SOLDERING - MATERIALO. Krammer: Stencil manufacturing and designSolder paste is a combination of pre-alloyed spherical metal powder andflux pastePacking of solder pastes: jar and syringeSolder pastehttp://engw Senj u2/44 REFLOW SOLDERING TECHNOLOGYThe reflow soldering technology basicallyconsists of three steps:1. deposition of the solder pasteby dispensing (topic )or by Stencil printing2. placement of the componentspick&place, collect&place,3. remelting the solder alloy in the solder paste usually in an Krammer: Stencil manufacturing and designSurface mounted resistor3/44 REFLOW SOLDERING TECHNOLOGYO. Krammer: Stencil manufacturing and design4/44 The reflow soldering technology basicallyconsists of three steps:1.
The stencil applied for depositing the solder paste is a thin, 75–200 µm thick metal foil, on which apertures are formed according to the solder pads on the printed circuit board. Stencil printing provides a fast, mass solder paste deposition process; relatively expensive, appropriate and recommended for mass production.
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