PDF4PRO ⚡AMP

Modern search engine that looking for books and documents around the web

Example: stock market

TEST METHOD STANDARD ELECTRONIC AND ELECTRICAL …

MIL-STD-202G 8 February 2002 SUPERSEDING MIL-STD-202F 1 APRIL 1980 DEPARTMENT OF DEFENSE TEST METHOD STANDARD ELECTRONIC AND ELECTRICAL COMPONENT PARTS AMSC N/A FSC 59GP DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited. INCH-POUND The documentation and process conversion measures necessary to comply with this revision shall be completed by 8 July 2002. MIL-STD-202G FOREWORD 1. This military STANDARD is approved for use by all Departments and Agencies of the Department of Defense. 2. Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use in improving this document should be addressed to: Defense Supply Center Columbus, 3990, Columbus, OH 43216-5000, by using the self-addressed Standardization Document Improvement Proposal (DDForm 1426) appearing at the end of this document or by letter.

Whenever these conditions must be closely controlled in order to obtain reproducible results, for referee purposes, a temperature of 25°C, +0°C, -2°C (77°F, +0°F, -3.6°F), relative humidity of 50 ±2 percent, and atmospheric pressure of 650 to 800 millimeters of mercury shall be specified.

Fullscreen Download
Loading..

Tags:

  Temperatures, Controlled

Information

Domain:

Source:

Link to this page:

Please notify us if you found a problem with this document:

Spam in document Broken preview Other abuse

Transcription of TEST METHOD STANDARD ELECTRONIC AND ELECTRICAL …

Documents from same domain

Assessing and Mitigating Radiation Effects in Xilinx FPGAs

nepp.nasa.gov

This research was carried out at the Jet Propulsion Laboratory, California Institute of Technology, and was sponsored by the National Aeronautics and Space Administration Electronic Parts and Packaging (NEPP) Program.

  Assessing, Radiation, Effect, Xilinx, Mitigating, Propulsion, Jet propulsion, Assessing and mitigating radiation effects in xilinx

Mechanical Properties and Microstructure Investigation Of ...

nepp.nasa.gov

Sn-Ag-Cu alloy is considered the preferred substitute for tin-lead solder in reflow applications due to its relatively low melting temperature, and superior mechanical properties and solderability compared with other lead free solders.

  Mechanical, Free, Deal, Properties, Flowers, Solder, Lead free, Mechanical properties, Lead solder

32 IEEE TRANSACTIONS ON ELECTRONICS PACKAGING ...

nepp.nasa.gov

COUREY et al.: TIN WHISKER ELECTRICAL SHORT CIRCUIT CHARACTERISTICS—PART I 33 considers the following factors: conductor spacing, lead con-tent in tin plating, process by which the tin was deposited, tin thickness, materialdirectly beneaththetin, substrate controlling

  Electrical, Part, Short, Circuit, Characteristics, Whisker, Tin whisker electrical short circuit characteristics part

IEEE TRANSACTIONS ON ELECTRONICS PACKAGING …

nepp.nasa.gov

COUREY et al.: TIN WHISKER ELECTRICAL SHORT CIRCUIT CHARACTERISTICS—PART II 43 Fig. 4. Schematic diagram for the tin whisker test station instrumentation. Re-produced from [4]. Fig. 5. Tin whisker test station probing area close up.

  Electrical, Transactions, Packaging, Electronic, Part, Short, Circuit, Characteristics, Whisker, Transactions on electronics packaging, Whisker electrical short circuit characteristics part

Temperature Dependent Dielectric Properties of ...

nepp.nasa.gov

Temperature Dependent Dielectric Properties of Polycrystalline 96%Al 2O 3 Liang-Yu Chen1 and Gary W. Hunter2 1Ohio Aerospace Institute/NASA Glenn Research Center at Lewis Field, Cleveland, OH 44135 2NASA Glenn Research Center at Lewis Field, Cleveland, OH 44135 Abstract Polycrystalline Al 2O 3 substrates have been proposed and tested for high ...

  Temperatures, Dependent, Properties, Dielectric, Polycrystalline, Temperature dependent dielectric properties of, Temperature dependent dielectric properties of polycrystalline

Photonic Integrated Circuit (PIC) Device Structures ...

nepp.nasa.gov

and construct electronic devices onto a single CMOS chip. Photonic integrated circuits (PICs) exist as the optical analog to integrated circuits; however, in place of transistors, PICs consist of numerous scaled

  Devices, Electronic, Circuit, Electronic devices

Radiation Effects Assessment of MRAM Devices - NASA

nepp.nasa.gov

Radiation Effects Assessment of MRAM Devices Mohamed Elghefari Jet Propulsion Laboratory Pasadena, California Steve McClure Jet Propulsion Laboratory Pasadena, California Jet Propulsion Laboratory California Institute of Technology Pasadena, California JPL Publication 08-19 5/08 .

  Assessment, Devices, Radiation, Effect, Propulsion, Ramm, Jet propulsion, Radiation effects assessment of mram devices

S-311-S-819 - Resistor, Fixed, Foil (Managanin) Power ...

nepp.nasa.gov

Surface Mount CODE 311 SUPERVISORY APPROV~: I I I Ronald Chinnapongse ~~ Ir~7 ... fOil, precIsion, current sensing resistor In a surface mounted package. This 4-terminal (two power J-shaped and two sense gull-wing-shaped) resistor is intended for use in ... Marking shall in no way interfere with or obscure any of the original manufacturer's ...

  Surfaces, Mount, Marking, Resistor, Surface mount

S-311-S-821 - Resistor, Fixed, Foil (Manganin), Chip ...

nepp.nasa.gov

fOil, precIsion, current sensing resistor In a surface mounted package. This chip ... Marking shall in no way interfere with or obscure any of the original manufacturer's marking. b. The number of lines shall be at discretion of the test facility or laboratory. ... Foil (Manganin), Chip, Power, Current Sensing, Surface Mount ...

  Surfaces, Mount, Marking, Resistor, Surface mount

Space Grade Requirements for Electrical Connectors

nepp.nasa.gov

GSFC-S-311-P-10, Subminiature, electrical and coaxial contact, electrical, connector. Military Specifications and Standards MIL-STD-1344 Test Methods for Electrical Connectors MIL-STD-202: Test Methods for Electronic and Electrical Component parts MIL-C-5015, Circular, threaded, AN type, electrical, connector.

  Electrical, Requirements, Grade, Space, Space grade requirements for electrical

Related documents

Active and Intelligent Packaging: Innovations for the Future

www.iopp.org

Active Packaging: Anti­microbial Systems for Food Packaging An exciting innovation in active packaging is the potential for the controlled release of antimicrobials from packaging materials. Antimicrobials incorporated in packaging materials could extend shelf live by preventing bacterial growth and spoilage.

  System, Packaging, Controlled

Guidelines on air handling in the food industry

food-info.net

comes in contact with food must be controlled. The controlled properties of air, especially temperature and humidity, may be used to prevent or reduce the growth rate of some micro-organisms in manufacturing and storage areas. The particle content—dust and micro-organisms— can also be controlled to limit the risk of product

  Food, Temperatures, Controlled

Professional Thin Film Chip Resistors

www.vishay.com

TEMPERATURE COEFFICIENT AND RESISTANCE RANGE (1) TYPE / SIZE TCR TOLERANCE RESISTANCE E-SERIES MCS 0402 ± 50 ppm/K Jumper, Imax. MCT 0603 ± 50 ppm/K Jumper, Imax. MCU 0805 ± 50 ppm/K Jumper, Imax. MCA 1206 ± 50 ppm/K Jumper, Imax. PACKAGING TYPE / SIZE CODE QUANTITY PACKAGING STYLE WIDTH PITCH …

  Packaging, Temperatures

CHAPTER 21 STORAGE OF MEDICATIONS

file.cop.ufl.edu

storage of controlled drugs listed in Schedule II of the Comprehensive Drug Abuse Prevention and Control Act of 1970 and other drugs subject to abuse, except when the facility uses single unit package drug distribution systems in which the quantity stored is minimal and a missing dose can be readily detected. Interpretive Guideline: 483.60(g)(2).

  System, Controlled

BC817-40W - 45 V, 0.5 A, General Purpose NPN Transistor

www.onsemi.com

Figure 7. Temperature Coefficients +1 IC, COLLECTOR CURRENT (mA) Figure 8. Capacitances 0.1 1 1 10 100 1000-2-1 0 V CE, COLLECTOR-EMITTER VOLTAGE (VOLTS) V, TEMPERATURE COEFFICIENTS (mV/ C)° θ C, CAPACITANCE (pF) 1.0 0.8 0.6 0.4 0.2 0 0.01 0.1 10 1001 10 100 TJ = 25°C IC = 10 mA VC for VCE(sat) VB for VBE Cob Cib 100 mA 300 mA 500 mA Figure ...

  Temperatures

MBR0520LT1 - Surface Mount Schottky Power Rectifier

www.onsemi.com

Storage Temperature Range Tstg −65 to +150 C Operating Junction Temperature TJ −65 to +125 C Voltage Rate of Change (Rated VR) dv/dt 1000 V/ s ESD Ratings: Machine Model = C Human Body Model = 3B > 400 > 8000 V Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

  Temperatures

Related search queries

PACKAGING, Systems, Controlled, Food, Temperature