Transcription of www.abb.com/semiconductors POWER MODULES …
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7 2011 POWER Electronics Europe IGBT Press-Packs for theIndustrial MarketThe standard Press-pack IGBT (PPI) basically uses the same packaging concept as Bipolar high powersemiconductor devices. The main difference is that the high POWER semiconductor content in the package issquare IGBT chips arranged on a round molybdenum disc instead of large, round bipolar devices matchedin size to the molybdenum disc and ceramic housing. The Press-pack IGBT comes under the nameStakPakTMin a pseudo-square frame package that allows for much better utilization of the squared IGBT chips and for a modular platform in POWER scaling of the device. B lent Aydin, Franc Dugal, EvgenyTsyplakov, Raffael Schnell, Liutauras Storasta and Thomas Clausen, ABB Switzerland Ltd,Semiconductors, Lenzburg, SwitzerlandOriginally, it was thought that the PPIswould replace Gate Turn-Off Thyristors(GTOs) in both medium voltage drives andtraction drives and be an alternative to theinsulated IGBT MODULES .
www.abb.com/semiconductors POWER MODULES 21 www.power-mag.com Issue 7 2011 Power Electronics Europe designed carrier lifetime control layers in …
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