Transcription of XPT IGBT Module V= V CES I= A C25 - IXYS …
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MIXA450PF1200 TSFP hase leg + free wheeling Diodes + NTCXPT igbt Module564128710/1139 Part numberMIXA450PF1200 TSFB ackside: isolatedC25CE(sat) A2xFeatures / Advantages:Applications:Package: High level of integration - only one power semiconductor Module required for the whole drive Rugged XPT design (Xtreme light Punch Through) results in: - short circuit rated for 10 sec. - very low gate charge - low EMI - square RBSOA @ 3x Ic Thin wafer technology combined with the XPT design results in a competitive low VCE(sat) Temperature sense included SONIC diode - fast and soft reverse recovery - low operating forward voltage AC motor drives Pumps, Fans Air-conditioning system Inverter and power supplies UPSSimBus F Industry standard outline RoHS compliant Soldering pins for PCB mounting Height: 17 mm Base plate: Copper internally DCB isolated Advanced power cycling Isolation Voltage: V~3000 ixys reserves the right to change limits, conditions and according to IEC 60747and per semiconductor unless otherwise specified 2012 ixys all rights reservedMIXA450PF1200 TSF-di /dt = A/ s
MIXA450PF1200TSF Phase leg + free wheeling Diodes + NTC XPT IGBT Module 5 6 4 2 1 8 7 10/11 3 9 Part number MIXA450PF1200TSF Backside: isolated C25 VV CE(sat) 1.8
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