Transcription of Yield and Yield Management - Smithsonian Institution
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Yield and Yield Management - Smithsonian Institution
3. Yield and Yield Management 3 Yield and Yield Management Clearly line Yield and defect density are two Yield improvement is the most critical goal of the most closely guarded secrets in the of all semiconductor operations as it reflects semiconductor industry. Line Yield refers to the amount of product that can be sold rela- the number of good wafers produced with- tive to the amount that is started. Yield is also out being scrapped, and in general, measures the single most important factor in overall the effectiveness of material handling, wafer processing costs. That is, incremental process control , and labor. Die Yield refers to increases in Yield (1 or 2 percent) signifi- the number of good dice that pass wafer cantly reduce manufacturing cost per wafer, probe testing from wafers that reach that or cost per square centimeter of silicon. In the part of the process. It is intended to prevent fab, Yield is closely tied to equipment perfor- bad dice from being assembled into pack- mance (process capability), operator train- ages that are often extremely expensive and ing, overall organizational effectiveness, and measures the effectiveness of process control , fab design and construction.
process control, and labor. Die yield refers to the number of good dice that pass wafer probe testing from wafers that reach that part of the process. It is intended to prevent bad dice from being assembled into pack-ages that are often extremely expensive and measures the effectiveness of process control, design margins, and particulate control.
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