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Accelerating Innovation Through a Standard Chiplet Interface

Accelerating Innovation Through a Standard Chiplet Interface

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packaging that uses bumps spaced 130 or 150 microns apart. Application Presentation Session Transport Network Data Link Media Access Controller (MAC) Physical (PHY) Application Presentation Session Transport Network Data Link Physical (PHY) Figure 2. AIB is a physical-layer specification. This very fine pitch permits a single AIB interface to use

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