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Ball Grid Array (BGA) Packaging - Intel
The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads) packages are many. Having no leads to bend, the PBGA has greatly reduced coplanarity problems and minimized handling issues.
Download Ball Grid Array (BGA) Packaging - Intel
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