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Ball Grid Array (BGA) Packaging - Intel

Ball Grid Array (BGA) Packaging - Intel

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connected by vias. BT (Bismaleimide Triazine) resin reinforced with glass fiber forms the core of the organic substrate. Solder bumps (3% Sn, 97% Pb) on the die surface are joined with solder pads (60% Sn, 40% Pb) on the organic substrate in a …

  Intel, Core

Download Ball Grid Array (BGA) Packaging - Intel


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