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Ball Grid Array (BGA) Packaging - Intel

Ball Grid Array (BGA) Packaging - Intel

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2000 Packaging Databook 14-1 Ball Grid Array (BGA) Packaging 14 14.1 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads) packages are many.

  Intel, 14 14

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