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Ball Grid Array (BGA) Packaging - Intel

Ball Grid Array (BGA) Packaging - Intel

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Ball Grid Array (BGA) Packaging clad bismaleimide triazine (BT) laminate. Four-metal layer substrate designs generally contain ad-ditional power and/or ground planes to improve electrical and thermal performance. The die and bonds are protected and encapsulated with molding compound. Via holes drilled through the sub-

  Intel, Grid, Power

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