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Fabrication, Layout and Design Rules

Fabrication, Layout and Design Rules

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Etching It is the process of selectively removing unwanted materials from the wafer surface. Two methods are used, wet etching and dry etching. Wet etching method has the disadvantage of producing undercuts. Dry etching on the other hand is good for small geometries. Lithography Is the process of patterning the layout to the masks.

  Etching

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