Flux/underfill Compatibility Study for Flip-chip …
2. Preparation and Experimental Procedure 2.1. Assembly The test component was a GNRU07-003LF IC GNR FLIPCHIP NP4* with polyimide passivation. Two lead-free alloys were used as bump metallurgy [1]: Sn/3.5 Ag/0.5 Cu and Sn/3.0 Ag/1.0 Cu.
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