FO-WLPと再配線絶縁材料の 技術･市場展望
調査の対象とポイント <調査対象> FO-WLP (Fan-out Wafer Level Package): Chip-Firstタイプ, RDL-Firstタイプ ※但し、RDL-Firstタイプで半導体フォトリソ技術を使用しないタイプは対象外とした
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FO-WLP & Encapsulant Report
www.jms21.co.jpFO-WLP & Encapsulant Report ~ Markets and Technologies ~ < New market survey report > Japan Marketing Survey Co., Ltd http://www.jms21.co.jp/ TEL:81-3-5641-2871 FAX:81-3-5641-0528
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