MARKING, SYMBOLS AND LABELS FOR IDENTIFICATION …
MARKING, SYMBOLS AND LABELS FOR IDENTIFICATION OF LEAD (Pb) FREE ASSEMBLIES, COMPONENTS AND DEVICES 1 FOREWORD Certain electronic components and systems are required to be lead (Pb) free or otherwise meet the
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Separable - INEMI
thor.inemi.orgPRODUCT CHARACTERISTICS: • Contacts: Metallic Pin-and-Socket, Spring, Blade, Card-Edge or Fiber-Optic. • Housings: Injection, Insert Molded Plastics, Metal • System Requirements: Electrical-to-Electronic, Tighter Mechanical Specs & Reliability,
In Search of the Perfect Bill of Materials (BoM) - …
thor.inemi.orgIn Search of the Perfect Bill of Materials (BoM) Connect with and Strengthen Your Supply Chain NEMI a white paper by the NEMI Perfect BoM Team March 2002
The Pb-Free BGAs in SnPb Assembly Process Project (The ...
thor.inemi.orgthe typical SnPb reflow processing conditions (Non-uniform microstructure) may lead to lower solder joint reliability. Overview of the Project Phases • Phase 1: To assess the process parameters for assembling Pb-free SnAgCu ... To Characterize microstructural homogeneity of lead-free BGAs in a SnPb process • Phase 3: ...
Insertion Loss Measurement of Low Loss Fiber Optic Splices
thor.inemi.orgResults from a National Electronics Manufacturing Initiative (NEMI) project, formed to improve aspects of fiber optic fusion splicing, are reported. The focus of this paper is ultra low loss splicing for telecommunications product assembly, with
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Soldering Guidelines for Mounting Bottom-terminated …
www.psemi.comApplication Note 62 Soldering Guidelines for BTCs DOC-78164-1 – (10/2016) Page 3 www.psemi.com SMD P Solder Paste Printing Solder Paste The solder paste is the vehicle that provides the flux and solder alloy necessary for a reliable