PCB (Printed Circuit Board) 개요
Dry Film(Photo Resist)을적층하는공정 조도형성방법 표면조도: 0.5~1.5um Mylar layer: Polyester재질로투과 율과정전기등중요특성을가지 고Photosensitive Layer를보호함 Photosensitive layer: 고분자 화합물로되어있으며, UV (자외선)와반응하여경화 Cover layer: Polyethylene 재질로
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