PCB (Printed Circuit Board) 개요

1 1 PCB ( printed Circuit Board) Briefing 2 ?II. PCB III. IV. V. VI. ? ( , ) . / (Copper Foil) , (Hole) PCB 4II. PCB 19301940196019702000199019801950 PCB (PualEisler) PCB (IBM ) PCB (Motorola ) PCB (Hazeltine )3640536169 FPC (Philips )8991P-BGA (IBM )Build-up (IBM )63728297 PCB PCB PCB Build-up PCB P-BGA CSP 9902FC-BGA 5 III.

2 1. PCB , , ( ) 6 III. 0100200300400500200020012002200320042005 2006 / PCB PCB 2001~2002 2 /IT PCB 80% 12% 4 25%, 20%, 14% 2. PCB 02,0004,0006,0008,00010,00012,00014,0002 000200120022003200420052006 PCB ( ) ( )7 III. 2006 PCB 8 4 , 65%, 35%( 15%, 5%, 5%, 10%) 3.

3 PCB 020,00040,00060,00080,000100,00020042005 2006 15% 5% 5% 10% 65% PCB PCB 2004 ( ) 40,40048,20020%54,50013%10%100 10,10011,30012%12,90014%8%20 2,8003,40021%4,20024%14%60 2,7003,60033%4,10014%15%20 4,4007,40068%8,80019%26%180 60,40074,00023%84,50014%12%380 [ : / ]2005 2006 8 III. WET 10% 7%Desmear 7% 25% 8% 3% 40% 31% / 12% 5% 5% / 7% 8% 16%Mass-Lam 12% 6% 15% 9% 12%Router 4%Laser Drill 4%Drill 10%Vaccum Press12%Imaging System13%Wet Line 9% 6%Bonding Sheet5%Coverlay9%FCCL23%RCC6%Prepreg8%CC L23% 15%Dry Film6%Solder Resist5%IC-Substrate18%Rigid-Flex4% / 13% 23%Build-up21%Flex / 11%Flex 10%4.

4 PCB (54,500 ) (12,900 ) (4,100 ) (8,800 ) (4,200 )9IV. Mother board ( )IC-Substrate ( )Rigid Flex Single side PCBD ouble side PCBM ulti-layer PCB Rigid Flex BGAP-BGAFC-BGACSPFC-CSPCSPBOCSIPFlex-BGA E poxy, PhenolPolyimideMetal Core, Ceramic etcBTPolyimideTape-BGAR igid-Flex PCBS ingle side PCBD ouble side PCBM ulti-layer PCB BGA [Ball Grid Array] FC-BGA [Flip Chip BGA] CSP [Chip Scale Package] BOC [ board On Chip] SIP [System In Package] PGA [Pin Grid Array] LGA [Land Grid Array] PGAFC-PGA LGA10V.

5 PCB Subtractive Additive SubtractiveAdditive Tenting / Panel Panel/Pattern / Panel Pattern Full Additive Pattern Semi-Additive Panel Pattern 11V. CCL CADCAM (Working Panel) D/FLamination D/F D/F Etching D/F AOI Lay Up V-PressX-Ray DrillCNC DrillDeburringDesmear Panel Panel D/FLamination D/F D/F Etching D/F AOI S/R S/R S/R (Router/ ) Tenting [ PCB ]12V.

6 Build-up ? PCB , 300um 150um , CCL RCC (Copper Foil + Resin) Tenting CCL CADCAM (Working Panel) D/F Lamination D/F D/F DeburringDesmearViaEtchingLaserAblation Panel Panel D/FLamination D/F AOI S/R S/R S/R (Router/ ) Etching D/F AOI Lay-up V-PressX-Ray DrillCNC Drill D/F D/F Etching[Build-up ]13V. Panel/Pattern CCL CADCAM (Working Panel) D/FLamination D/F D/F Etching D/F AOI Lay Up V-PressX-Ray DrillCNC DrillDeburringDesmear Panel Panel D/FLamination D/F D/F Pattern Solder D/F Etching Solder AOI S/R S/R (Router/ ) S/R [ PCB ]14V.

7 Semi-Additive CCL CADCAM (Working Panel) D/FLamination D/F D/F Etching D/F AOI Lay Up V-PressX-Ray DrillCNC DrillDesmearTexturing Panel D/FLamination D/F D/F Pattern D/F Micro Etching AOI S/R S/R S/R (Router/ ) [ PCB ]15VI. PCB (CAD/CAM)CAM FlowGerber Data InputCAM S/W data CAD : CAM :CAD data CAD Flow ( / ) ( ) ( / Rule ) User Spec/Technical ReviewData Gerber Data Working Panel Data Data / Artwork film -Gerber/Drilling-NC/Router-Mount Data 16VI.

8 ( MLB Subtractive ]1. CCL (Copper Clad Laminate) Prepreg Lamination Prepreg(50~100um)Copper foil (35/18/12um)2. Working Panel CCL Polyimide(25um)Adhesive(25 )FCCLCCL CCL WorkingPanelWorkingPanelWorkingPanelSize Regular:900X1,200mmJumbo:1,000X1,200mmSi ze405X510mm510X610mm Lamination FCCL (Flexible Copper Clad Laminate)17VI. 3. (Roughness) Dry film -Buff : , Brush -Jet : -Soft Etching: (35%) (10%) 2:8 4.)

9 D/F Lamination Dry film (Photo Resist) : ~ layer: polyester Photosensitive Layer Photosensitive layer: , UV ( ) Cover layer: Polyethylene Photosensitive layer lamination Dry film ( )18VI. 5. D/F CCL Dry film Artwork film UV( ) 6. D/F ( ) Copper Foil (UV)Artwork FilmDry film -Lamp UV( ) Copper FoilCopper Foil D/F : (Na2CO3 1%) (K2CO3) 19VI.

10 7. (Etching) D/F D/F 8. D/F Etching D/F Alkali (NaOH KOH) : 2 (CuCl2) (FeCl3) Copper FoilC/FD/F C/F : (NaOH) (KOH) D/F 20VI. 9. AOI( ) ( ) 10. (Black Oxidation) Prepreg Substrate Illumination Design Rule Check Reference Rule Check CAD Reference DataCAD Photo Data CleaningAOI VRS(Verification Station)Alkaline Cleaner(D/F ) Micro-Etching( )Pre-Dip( )Post-Dip( )Oxide( ) ( ) ( ) CuO Cu2O Black OxideBrown Oxide 21VI.