The Chip Scale Package (CSP) - Intel
eventually leads to ball pitches as small as .5mm and below. Currently the majority of µbga packages are in .75mm pitch. 15.2.2 µBGA* Package Drawing and Dimensions Figure 15-3. Example µBGA* Package Drawing and Dimensions Note: The µBGA package is die-size dependent and may vary. Actual products vary with different levels
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