6-Pin Dip Zero-Cross Optoisolators Triac Driver …

1 DESCRIPTIONThe MOC303XM and MOC304XM devices consist of a AlGaAsinfrared emitting diode optically coupled to a monolithic silicondetector performing the function of a zero voltage crossing bilat-eral Triac are designed for use with a Triac in the interface of logicsystems to equipment powered from 115 VAC lines, such asteletypewriters, CRTs, solid-state relays, industrial controls,printers, motors, solenoids and consumer appliances, Solenoid/valve controls Lighting controls Static power switches AC motor drives Temperature controls contactors AC motor starters Solid state relaysFEATURES Simplifies logic control of 115 VAC power Zero voltage crossing dv/dt of 2000 V/ s typical, 1000 V/ s guaranteed VDE recognized (File # 94766)-ordering option V ( , MOC3043VM)616611 MAIN *N/C*DO NOT CONNECT( Triac SUBSTRATE)123 ANODECATHODE456 MAIN DEVICETSTGAll-40 to +150 CStorage TemperatureOperating TemperatureTOPRAll-40 to +85 CLead Solder TemperatureTSOLAll260 for 10 sec CJunction Temperature RangeTJAll-40 to +100 CIsolation Surge Voltage(1)(peak AC voltage, 60Hz, 1 sec duration)VISOAll7500 Vac(pk)Total Device Power Dissipation @ 25 CPDAll250mWDerate above 25 CEMITTERIFAll60mAContinuous Forward CurrentReverse VoltageVRAll6 VTotal Power Dissipation 25 C AmbientPDAll120mWDerate above 25 CDETECTORMOC3031M/2M/3M250 Off-State Output Terminal VoltageVDRMMOC3041M/2M/3M400 VPeak Repetitive Surge Current (PW = 100 s, 120 pps)ITSMAll1 ATotal Power Dissipation @ 25 C AmbientPDAll150mWDerate above 25 C 2001 Fairchild Semiconductor CorporationDS3002568/06/011 OF MAXIMUM RATINGS(TA= 25 C unless otherwise noted) 6-Pin DIP ZERO-CROSSOPTOISOLATORS Triac Driver OUTPUT(250/400 VOLT PEAK)MOC3031 MMOC3032 MMOC3033 MMOC3041 MMOC3042 MMOC3043 MNote1.

2 Isolation surge voltage, VISO, is an internal device dielectric breakdown rating. For this test, Pins 1 and 2 are common, and Pins 4, 5 and 6 are ConditionsSymbolDeviceMinTypMaxUnitsEMIT TERI nput Forward VoltageIF= 30 Leakage CurrentVR= 6 ADETECTORPeak Blocking Current,Either DirectionRated VDRM, IF= 0 (note 1)IDRM1 All100nAPeak On-State Voltage,Either DirectionITM= 100 mA peak, IF= Rate of Rise of Off-State VoltageIF= 0 (figure 9, note 3)dv/dtAll1000V/ sINDIVIDUAL COMPONENT CHARACTERISTICSELECTRICAL CHARACTERISTICS (TA= 25 CUnless otherwise specified)DC CharacteristicsTest ConditionsSymbolDeviceMinTypMaxUnitsMOC3 031M/MOC3041M15 LED Trigger CurrentMain terminal voltage = 3V (note 2)IFTMOC3032M/MOC3042M10mAMOC3033M/MOC30 43M5 Holding Current, Either DirectionIHAll400 ATRANSFER CHARACTERISTICS(TA= 25 C Unless otherwise specified.) OF 98/06/01DS300256 Note1. Test voltage must be applied within dv/dt All devices are guaranteed to trigger at an IFvalue less than or equal to max IFT.

3 Therefore, recommended operating IFlies between max IFT(15 mA for MOC3031M & MOC3041M, 10 mA for MOC3032M & MOC3042M, 5 mA for MOC3033M & MOC3043M) and absolute max IF(60 mA).3. This is static dv/dt. See Figure 9 for test circuit. Commutating dv/dt is a function of the load-driving thyristor(s) ConditionsSymbolDeviceMinTypMaxUnitsInhi bit VoltageIF= rated IFT, MT1-MT2 voltage above VIHAll20 Vwhich device will not trigger off-stateLeakage in Inhibited StateIF= rated IF, rated VDRM, off-stateIDRM2 All500 AZERO CROSSING CHARACTERISTICS(TA= 25 C Unless otherwise specified.) 6-Pin DIP ZERO-CROSSOPTOISOLATORS Triac Driver OUTPUT(250/400 VOLT PEAK)MOC3031 MMOC3032 MMOC3033 MMOC3041 MMOC3042 MMOC3043 MDS3002568/06/013 OF , AMBIENT TEMPERATURE (oC) -40-20020406080100 IDRM, LEAKAGE CURRENT (nA) , AMBIENT TEMPERATURE (oC)-40-20020406080100 IFT , , ON-STATE VOLTAGE (VOLTS)-4-3-2-101234 ITM, ON-STATE CURRENT (mA)-800-600-400-2000200400600800IF - LED FORWARD CURRENT (mA) - FORWARD VOLTAGE (V) 3.

4 Trigger Current vs. TemperatureFigure 4. Leakage Current, IDRM vs. TemperatureFigure 1. LED Forward Voltage vs. Forward CurrentFigure 2. On-State CharacteristicsTA = -40oCTA = 25oCTA = 85oCIF = 30mATA = 25oCNORMALIZED TO TA = 25oC6-PIN DIP ZERO-CROSSOPTOISOLATORS Triac Driver OUTPUT(250/400 VOLT PEAK) OF 98/06/01DS300256TA, AMBIENT TEMPERATURE (oC) -40-20020406080100 IDRM2, , LED TRIGGER PULSE WIDTH ( s) 110100 IFT, LED TRIGGER CURRENT (NORMALIZED)0246810121416TA, AMBIENT TEMPERATURE (oC) -40-20020406080100IH, HOLDING CURRENT (NORMALIZED) , AMBIENT TEMPERATURE (oC) -40-20020406080100 VINH - 7. Holding Current, IH vs. TemperatureFigure 8. Inhibit Voltage vs. TemperatureFigure 5. IDRM2 - Leakage in Inhibit State vs. TemperatureFigure 6. LED Current Required to Trigger vs. LED Pulse WidthIF = RATED IFTNORMALIZED TO PWIN >> 100 sNORMALIZED TO TA = 25oC6-PIN DIP ZERO-CROSSOPTOISOLATORS Triac Driver OUTPUT(250/400 VOLT PEAK)MOC3031 MMOC3032 MMOC3033 MMOC3041 MMOC3042 MMOC3043 MFigure 9.

5 Static dv/dt Test CircuitFigure 10. Static dv/dt Test Waveform(MOC3031M, MOC3032M, MOC3033M)Vdc+400 for MOC304XM+250 for MOC303 XMR = 10 k CTESTX100 SCOPEPROBEPULSEINPUTMERCURYWETTEDRELAY15 8 V0 VOLTSAPPLIED VOLTAGEWAVEFORMVmax = 250 Vdv/dt = Vmax = RC RC RC1. The mercury wetted relay provides a high speed repeatedpulse to the 100x scope probes are used, to allow high speeds The worst-case condition for static dv/dt is established by triggering the with a normal LED input current, then removing the current. The variable RTEST allows the dv/dt to be gradually increased until the continues to trigger in response to the applied voltage pulse, even after the LED current has been removed. The dv/dt is then decreased until the stops triggering. RC is measured at this point and 12. Hot-Line Switching Application Circuit(MOC3031M, MOC3032M, MOC3033M) VACHOTNEUTRAL180 *For highly inductive loads (power factor < ), change this value to 360 kMOC3031 MMOC3032 MMOC3033M39 *LOADT ypical circuit (Fig 12, 13) for use when hot line switching is required.

6 In this circuit the hot side of the line is switched and the loadconnected to the cold or neutral side. The load may be connected to either the neutral or hot calculated so that IFis equal to the rated IFTof the part, 5 mA for the MOC3033M and MOC3043M, 10 mA for the MOC3032 Mand MOC3042M, or 15 mA for the MOC3031M and MOC3041M. The 39 ohm resistor and F capacitor are for snubbing of the triacand may or may not be necessary depending upon the particular Triac and load 11. Static dv/dt Test Waveform(MOC3041M, MOC3042M, MOC3043M)252 V0 VOLTSAPPLIED VOLTAGEWAVEFORMVmax = 400 Vdv/dt = Vmax = 252 RC RC RCFigure 13. Hot-Line Switching Application Circuit(MOC3041M, MOC3042M, MOC3043M) VACHOTNEUTRAL360 *For highly inductive loads (power factor < ), change this value to 360 *LOADDS3002568/06/015 OF DIP ZERO-CROSSOPTOISOLATORS Triac Driver OUTPUT(250/400 VOLT PEAK) OF 98/06/01DS300256 Figure 14. Inverse-Parallel SCR Driver Circuit(MOC3031M, MOC3032M, MOC3033M)VCCRin123654115 VACSCR180 R1D1 SCRMOC3031 MMOC3032 MMOC3033MR2D2 LOADNote: This optoisolator should not be used to drive a load directly.

7 It is intended to be a trigger device method of firing two, back-to-back SCR s with a Fairchild Triac Driver . Diodes can be 1N4001; resistors, R1 and R2, areoptional 1 k 15. Inverse-Parallel SCR Driver Circuit(MOC3041M, MOC3042M, MOC3043M)VCCRin123654240 VACSCR360 R1D1 SCRMOC3041 MMOC3042 MMOC3043MR2D2 LOADS uggested method of firing two, back-to-back SCR s with a Fairchild Triac Driver . Diodes can be 1N4001; resistors, R1 and R2, areoptional 330 DIP ZERO-CROSSOPTOISOLATORS Triac Driver OUTPUT(250/400 VOLT PEAK) ( ) ( ) ( ) ( ) ( ) ( )Recommended Pad Layout for Surface Mount LeadformPackage Dimensions (Surface Mount) ( ) ( ) ( ) ( ) ( ) ( ) ( ) ( ) ( ) ( ) ( ) ( ) ( ) ( ) ( ) ( ) ( ) ( ) ( ) ( ) ( ) [ ]PIN Dimensions (Through Hole) ( ) ( ) ( ) ( ) ( ) ( ) ( ) ( ) ( ) ( ) ( ) ( ) ( ) ( ) ( ) ( )15 ( )PIN Dimensions ( Lead Spacing) ( ) ( ) ( ) ( ) ( ) ( ) ( ) ( ) ( ) ( ) ( ) ( ) [ ] ( ) ( ) ( ) ( ) ( ) ( )PIN dimensions are in inches (millimeters)DS3002568/06/017 OF DIP ZERO-CROSSOPTOISOLATORS Triac Driver OUTPUT(250/400 VOLT PEAK) OF 98/06/01DS300256 SSSurface Mount Lead BendSR2 SR2 Surface Mount.

8 Tape and Lead SpacingVVVDE 0884 TVTVVDE 0884, Lead SpacingSVSVVDE 0884, Surface MountSR2 VSR2 VVDE 0884, Surface Mount, Tape & ReelOptionOrder Entry IdentifierDescriptionORDERING MINUser Direction of Tape Specifications ( D Taping Orientation)NOTEAll dimensions are in inches (millimeters) 6-Pin DIP ZERO-CROSSOPTOISOLATORS Triac Driver OUTPUT(250/400 VOLT PEAK)MOC3031 MMOC3032 MMOC3033 MMOC3041 MMOC3042 MMOC3043M MARKING INFORMATION Reflow Profile (White Package, -M Suffix)MOC3031V X YY Q126435*Note Parts that do not have the V option (see definition 3 above) that are marked with date code 325 or earlier are marked in portrait logo2 Device number3 VDE mark (Note: Only appears on parts ordered with VDE option See order entry table)4 One digit year code, , 3 5 Two digit work week ranging from 01 to 53 6 Assembly package codeRamp up = 2 10 C/sec Peak reflow temperature: 245 C (package surface temperature) Time of temperature higher than 183 C for 120 180 seconds One time soldering reflow is recommended 230 C, 10 30 sTime (Minute) ( C)Time above 183 C, 120 180 sec245 C peakDISCLAIMERFAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANYPRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN.

9 FAIRCHILD DOES NOT ASSUME ANY LIABILITYARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES ITCONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and isnot intended to be an exhaustive list of all such SUPPORT POLICYFAIRCHILD S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORTDEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR used herein:1. Life support devices or systems are devices orsystems which, (a) are intended for surgical implant intothe body, or (b) support or sustain life, or (c) whosefailure to perform when properly used in accordancewith instructions for use provided in the labeling, can bereasonably expected to result in significant injury to A critical component is any component of a lifesupport device or system whose failure to perform canbe reasonably expected to cause the failure of the lifesupport device or system, or to affect its safety STATUS DEFINITIONSD efinition of TermsDatasheet IdentificationProduct StatusDefinitionAdvance InformationPreliminaryNo Identification NeededObsoleteThis datasheet contains the design specifications forproduct development.

10 Specifications may change inany manner without datasheet contains preliminary data, andsupplementary data will be published at a later Semiconductor reserves the right to makechanges at any time without notice in order to datasheet contains final specifications. FairchildSemiconductor reserves the right to make changes atany time without notice in order to improve datasheet contains specifications on a productthat has been discontinued by Fairchild datasheet is printed for reference information orIn DesignFirst ProductionFull ProductionNot In ProductionISOPLANAR LittleFET MICROCOUPLER MicroFET MicroPak MICROWIRE MSX MSXPro OCX OCXPro OPTOLOGIC OPTOPLANAR PACMAN POP FAST FASTr FPS FRFET GlobalOptoisolator GTO HiSeC I2C i-Lo ImpliedDisconnect Rev. I13 ACEx ActiveArray Bottomless CoolFET CROSSVOLT DOME EcoSPARK E2 CMOS EnSigna FACT FACT Quiet Series Power247 PowerEdge PowerSaver PowerTrench QFET QS QT Optoelectronics Quiet Series RapidConfigure RapidConnect SerDes SILENT SWITCHER SMART START SPM Stealth SuperFET SuperSOT -3 SuperSOT -6 SuperSOT -8 SyncFET TinyLogic TINYOPTO TruTranslation UHC UltraFET VCX Across the board.