Status of Panel Level Packaging & Manufacturing - …

1 Status of Panel Level Packaging & ManufacturingSampleFrom Technologies to Market 2015 2015 SAMPLEA uthors: S. Kumar, A. PizzagalliSource: FraunhoferIZM2 Biography& contactABOUT THE AUTHORSA mandine PIZZAGALLI, Market & Technology Analyst, Equipment and Materials for Advanced Packaging SantoshKumariscurrentlyworkingasSeniorTe chnology&MarketResearchAnalystatYoleD ,modelingandsimulation,reliabilityandmat erialcharacterization, (IIT), 2015 | Status of Panel - Level Packaging & Manufacturing report| |Santosh Kumar, Senior Market& TechnologyAnalyst3 TABLE OF CONTENTS1/2 INTRODUCTION,DEFINITIONS& ReportObjectives WhoShouldbeInterestedinthisReport? CompaniesCitedinthisReport Definitions,Limitations&Methodology Glossary DefinitionofPanelinfrastructure OverviewofthePaneltechnologies/Keysegmen tsdescriptions ApplicationstargetedwithPanel GeneralMotivationsandDrivers Keyplayersactivitiesworldwide Industrialplayersactivity KeyR&Dplayersactivity Supplychain Overviewoftheplayersandpositioningwithin thesupplychain CommercializationStatus 2014-2020 TotalMarketforecastPART2 KeyFOWLP basedpanelplayers FOWLP packageinfrastructureRoadmap DriverstoswitchfromwafertopanelforFOWLP Keychallenges/unmetneeds 2014-2020 MarketforecastPART3 Overviewofthetechnologiesavailable Productsandtechnologies.

2 Productavailable EmbeddeddiepackageinfrastructureRoadmap DriverstoswitchfromwafertopanelforEmbedd eddie TechnicalRequirements Keychallenges/unmetneeds 2014-2020 Marketforecast Embeddeddieplayers 2015 | Status of Panel - Level Packaging & Manufacturing report| |4 TABLE OF CONTENTS2/2 PART 4: Focus on Panel infrastructure for Glass Panel Organic interposer package infrastructure Roadmap Glass Panel interposer players: Drivers to switch from wafer to Panel for Glass interposer Technical Requirements Key challenges/unmet needs 2014-2020 Market forecast PART 5: Focus on Panel infrastructure for Organic Panel Organic interposer package infrastructure Roadmap Drivers to switch from wafer to Panel for Organic/Glass interposer Technical Requirements Key challenges/unmet needs Organic Panel interposer playersPART6 Equipment& Equipmentforpanel GeographicalmapofPanelequipmentvendor Key equipment suppliers and their businesses and Status Equipment vendor suppliers Status for Panel Breakdown by process step/type of equipment Materialsforpanel GeographicalmapofPanelmaterialvendors Overviewofthetechnologiesavailable Productsandtechnologies Productavailable Conclusion 2015 | Status of Panel - Level Packaging & Manufacturing report| |5 REPORT OBJECTIVES (1/2)

3 This technology and market report on Panel Manufacturing approaches for certain advanced packages in the semiconductor industry, and is being authored now, because: Growing interest in moving from wafer to Panel format for certain advanced Packaging platforms in the industry because of potential cost reductions and processing benefits It is a competitive market which is attracting new entrants from supply chains The objectives of this report are to: Provide an overview of the Panel packages technologies Describe the key applications that could use the Panel infrastructure Identify the Panel packages solutions and players supporting these packages Identify the current and future industrial players for each Packaging technology based on Panel Level Provide market data and forecasts on Panel products& equipment market for Panel technologies Determine the competitive landscape for each segment 2015 | Status of Panel - Level Packaging & Manufacturing report| |6 REPORT OBJECTIVES (2/2) Additional objectives of this report are to.

4 Assess the market for Panel Manufacturing , providing a forecast for 2014-2020 in terms of revenue and wafer starts Create a roadmap of the players involved Analyse packages technologies based on the Panel Level and trends Identify trends in overall equipment & materials for Panel processing Identify Manufacturing challenges related to the Panel infrastructure Provide an overview of the technological trends for Panel equipment tools and materials solutions The following applications, where Panel processes are also required, are not included: Display applications Photovoltaic 2015 | Status of Panel - Level Packaging & Manufacturing report| |7 WHO SHOULD BE INTERESTED IN THIS REPORT? Equipment&materialsuppliers: ToIdentifynewbusinessopportunitiesandpro spects ToUnderstandthedifferentiatedvalueofyour productsandtechnologiesinthismarket ToIdentifytechnologytrends,challengesand preciserequirementsrelatedtopanelinfrast ructure Toevaluateyourpanelpackagingtechnologies marketpotential Topositionyourcompanyinthemarket Tomonitorandbenchmarkyourcompetitors IDMs,CMOS foundriesandOSAT players: Tounderstandtechnologytrendsrelatedtopan elpackagingplatforms Tospotnewopportunitiesanddefinediversifi cationstrategies R&Dorganizationsandinvestors.

5 Toevaluatethemarketpotentialoffuturetech nologiesandproductsfornewapplicativemark ets Toidentifythebestcandidatesfortechnology transfers Tomonitorglobalactivityandconsolidationc urrentlyoccurringinthesemiconductorequip mentandmaterialsbusinessinordertoidentif ynewpartnersandtargets,andmaketherightde cisionsbeforecommittingtooneparticularsu pplier 2015 | Status of Panel - Level Packaging & Manufacturing report| |8 COMPANIES CITED IN THE REPORT (NON-EXHAUSTIVE LIST)AGC, Amkor, ASE, BESI, Dai Nippon, Dow Corning Corporation, Dow Electronic Materials, EP Works, HD Micro/Dupont, Heidelberg Instruments, Ibiden, Infineon, Intel, IMEC, Fraunhofer IZM, Jdevices, JSR Micro, Merck/AZ Em, Nikon, Orbotech,Orbotech, Panasonic, PlanOptik, Rudolph, Samsung Electro Mechanics (SEMCO), SCREEN, Shinko, SPIL, STATS ChipPAC, ST Microelectronics, SUSS MicroTec, Unimicron, Powertech Technologies, Rudolph, Shanghai Micro Electronics Equipment Co.

6 Ltd. (SMEE), SCREEN, Texas Instruments (TI), Tokyo Ohka Kogyo Co., LTD. (TOK), Triton Microtechnologies, TSMC, Shin-Etsu MicroSi, USHIO, and many 2015 | Status of Panel - Level Packaging & Manufacturing report| |9 FROMWAFER SIZE TO Panel SemiconductortechnologiesPCB Substrateindustry12 8 330 mm24 x24 HDI PWB18 x24 -HDI PWB16 x20 PCB substrates10 x14 -flexible PWB Standard PCB equipment& materials Line/Spacedown to 15 m Standard size: large area 24 X 24 /24 X 18 Double sidedroutingTrade-off betweenstandard wafer size and Panel size Standard thinfilm technologyequipment Line/Space: 2/2 m for fine pitch 2015 | Status of Panel - Level Packaging & Manufacturing report| |10 Panel SCALE Packaging PLAFORMKey platformsidentifiedto beconsideredas Panel levelpackaging & manufacturingKey Panel Level Packaging platformsFOWLPE mbedded dieINTERPOSER PLATFORMS ilicon Interposer* Glass interposerOrganic InterposerHybrid InterposerEMIB (Intel)EIC (Unimicron)ADVANCED SUBSTRATESSUBSTRATE LESSE mbedded interposerMay move to panelAlready on Panel *Siinterposer( )havingfinefeatures(<2/2um) , ,Siinterposerisnotcoveredindetailandwewi llgivethebriefoverviewofthepotentialanda ctivitiesoflowcostSiinterposertobeusedin panelformat.

7 2015 | Status of Panel - Level Packaging & Manufacturing report| |11 MOVING TO Panel BENEFITSM oving from wafer to Panel format has major cost and productivity advantages due to higher efficiency and economies of not to scale. for representative purpose x370 Panel 500 x500 Panel 330mm100%125%172%450%695%490110413362717 3906 Moving to Panel : higher economies of scale 2015 | Status of Panel - Level Packaging & Manufacturing report| |12 Panel TECHNOLOGIESKey packages segments basedon Panel levelintegrationPanel PackagesOrganicinterposerGlass interposerFO WLP PanelHybridinterposer Embedded die ChipLaminatedPCB5main available Panel technologies for Advanced Packaging 2015 | Status of Panel - Level Packaging & Manufacturing report| |13 APPLICATION TARGETED BY THE Panel TECHNOLOGYA pplications targeteddependingon the L/S resolutionrequirementThe applications are drivingthe segmentation of the RDL technologyrequested2 mLine/Space(L/S)

8 8 mApplication20 mMobile, consumer, Wifi, RF, TransducersRF, Power Management module IC, basebandFPGA, CPU/GPU, networking, servers 2015 | Status of Panel - Level Packaging & Manufacturing report| |14 TECHNICALGAPS BETWEENTHE WAFER AND PCB INFRASTRUCTURES filledby the Panel infrastructure There isa biggap in termsof technicalfeaturesbetweenthe front-end and Back-end/PCB infrastructuresbetweenthe front-end and PCB areas Gap in termsof coststructure and technicalfeatures2 mLine/Space(L/S)8 mFront-end technologiesWafer size (300 mm)PCB infrastructureCost20 mLowcostsolution requiredPanel infrastructureFO WLP Panel OrganicPanel interposerGlass Panel interposer5 m 2015 | Status of Panel - Level Packaging & Manufacturing report| |15 REVENUE FORECAST FOR Panel Level Packaging In M$The Panel Packaging industrywillreach$109M by 20170,050,0100,0150,0200,0250,0300,0350, 0400,0450,02014201520162017201820192020 Revenue (in M$)Revenue forecast for Panel Level Packaging (in M$)(Detailed breakdown includes glass Panel interposer, embedded die and FO WLP Panel )YoleDeveloppement November 2015 2015 | Status of Panel - Level Packaging & Manufacturing report| |16 RESOLUTION TRENDS (L/S: LINE/SPACE).

9 Packaging AREA ROADMAPNot readyReady for HVMR eady for initial ramp-up or development 2015 | Status of Panel - Level Packaging & Manufacturing report| |17 Panel PackagesOrganic interposerGlass interposer Hybrid interposerFOWLP Panel LevelEmbeddeddieBusiness modelsOSATsSubstrate makersR&DinstituteIDMPLAYERS POSITIONING INVOLVED IN THE Panel Level INFRASTRUCTURE* Amkor was actively involved in organic interposer but recently the interest has slowed down* 2015 | Status of Panel - Level Packaging & Manufacturing report| |18 Panel Manufacturing ADOPTIONKey players pushing the Panel Manufacturing platform FablessOSATsSubstrate makersIDMsFOWLP on panelEmbedded dieGlass interposerOrganic interposer Hybrid interposer 2015 | Status of Panel - Level Packaging & Manufacturing report| |19 OVERVIEW OF EQUIPMENT VENDORS OFFERING TOOLS FOR Panel PACKAGINGM ajor competitors for steppers Major competitors for Scanner & Laser ablationMajor competitors for PVDM ajor competitorsfor platingMajor competitors for Laser Direct ImagingMajor competitors for Pick & Place 2015 | Status of Panel - Level Packaging & Manufacturing report | |20 EQUIPMENTLINE INSTALLEDALREADYType of equipmentavailableof the marketSuppliersPanel Packages thatcanbeprocessedLithographyGlass interposerOrganicinterposerFO WLPP latingGlass interposerPVDO rganicinterposerFO WLP 2015 | Status of Panel - Level Packaging & Manufacturing report| |21 EQUIPMENT & MATERIALSSUPPLIERSINVOLVEDIN THE Panel

10 INFRASTRUCTUREE mbedded die 2015 | Status of Panel - Level Packaging & Manufacturing report| |22 MORE SLIDES EXTRACTED 2015 | Status of Panel - Level Packaging & Manufacturing report| |23 OUR LATESTREPORTSC omingSoonComingSoonComingSoon 2015 | Status of Panel - Level Packaging & Manufacturing report| | 2016 Yole D veloppementFromTechnologies to Market25 2016 | | About Yole D veloppementMEMS & SensorsLEDC ompound PackagingBatteries / EnergyManagementPower Electronic