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Sputtering Target Materials For Electronic Devices
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CHAPTER 6: Etching - City University of Hong Kong
www.cityu.edu.hkexcited electronic states that later decay by photoemission, thereby causing the ... the target surface and under the operating pressure, argon ions arrive ... sputtering rates for different materials. Figure 6.6(b) depicts the schematic of a parallel - plate plasma etching system.
Atomic Layer Deposition - ALD Academy
www.aldacademy.combuilding blocks of modern electronic devices. Since the 45-nm technology node of transistors, thermally grown SiO 2 has become inadequate and high-quality nanome-ter-thick films of materials such as HfO 2 need to be de-posited (Fig. 2a). A thickness control at the subnanome-Fig. 2b), uniformly over 300 mm silicon wafers, is necessary.