Wcsp package
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bq51003EVM-764 Evaluation Module (WCSP Package)
www.ti.comTest Procedure www.ti.com Table 2. Pin Description (continued) PIN Number (WCSP) bq51003 F2 FOD F3 AD-EN F4 CHG G1 ILIM G2 EN2 G3 EN1 G4 AD 5 Test Procedure This procedure describes test configuration of the bq51003 evaluation board (HPA764-006) for bench
New Logic Packaging - TI
www.ti.com.twlogic.ti.com 2 Texas Instruments New Logic Packaging WCSP Introduction(NanoStar TM/NanoFree TM) NanoStarTM and NanoFreeTM is the smallest industry standard logic package with proven world-class reliability designed for today's high-volume manufacturing environment.
NanoStar & NanoFree 300 m Solder Bump Wafer Chip-Scale ...
www.ti.comSBVA017 NanoStar & NanoFree 300 m Solder Bump Wafer Chip-Scale Package Application 5 2 Physical Description 2.1 Package Characteristics The NanoStar package family is a Die Size BGA as identified by the JEDEC standards organiza-
50 mΩ, Slew Rate Controlled Load Switch in WCSP
www.vishay.comSiP32460, SiP32461, SiP32462 www.vishay.com Vishay Siliconix S14-0842-Rev. D, 28-Apr-14 2 Document Number: 67754 For technical questions, contact: powerictechsupport@vishay.com