Search results with tag "Underfill"
Flux/underfill Compatibility Study for Flip-chip …
www.ipcsit.comFlux/underfill Compatibility Study for Flip-chip Assembly Process Phuthanate Phoosekieaw1+and Sanya Khunkhao1 1Faculty of Engineering, Department of Electrical Engineering Sripatum University, 61 Phaholyothin Rd, Jatujak, Bangkok 10900, Tel (662) 579-1111 Ext: 2272
and Application of Underfill Material for Flip Chip and ...
www.ipc.orgIPC J-STD-030 Guideline for Selection and Application of Underfill Material for Flip Chip and Other Micropackages Developed by the Underfill Adhesives for Flip Chip Applications Task
TECHNOLOGY SOLUTIONS Flip Chip Packaging
c44f5d406df450f4a66b-1b94a87d576253d9446df0a9ca62e142.ssl.cf2.rackcdn.comlife of the finished package. The chip attach and underfill steps are the basics of flip chip interconnect. Beyond this, the remainder of package construction surrounding the die can take many forms and can generally utilize existing manufacturing processes and package formats. Demand for flip chip interconnect technology is being driven by a
FOR IMMEDIATE RELEASE Press Release
www.semiconductorpackagingnews.comThis material can be used as an underfill for flip chip, chip scale package, ball grid array devices, package on package, and land grid array applications. It is also suitable for bare chip protection in a variety of advanced packages such as memory cards, chip carriers, hybrid circuits and multi-chip modules.
Cooling from Down Under – Thermally Conductive …
www.imapsfrance.orgCooling from Down Under – Thermally Conductive Underfill 7th European Advanced Technology Workshop on Micropackaging and Thermal Management Paul W. Hough, Larry Wang 1, 2 February 2012
Compact Camera Modules - LOCTITE
www.loctite.sgCompact Camera Modules | 3 Camera Module Assembly Die Attach Electrically Conductive Adhesives House / IR Filter / Lens Bonding Adhesives Underfill