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Zynq-7000 SoC Packaging and Pinout Product Specification
www.xilinx.comThe FFG, FBG, SBG, and RFG flip-chip packages are RoHS 6 of 6 compliant, with exemption 15 where there is lead in the C4 bumps that are used to complete a viable electrical connection between the semiconductor die and the package substrate.
ChiP and VIA Packages DCM™ Family - Vicor Corporation
www.vicorpower.comicorpoercom e 35 032018 Family of DCM Products = Also Available in VIA package ChiP and VIA Packages DCM™ Family Isolated, Regulated DC-DC Converter Modules For use in: Industrial and Process Control, Distributed Power, ATE, Communications,