Search results with tag "Grid array"
AN2265 - Assembly Guidelines for Land Grid Array (LGA ...
www.nxp.comThe Land Grid Array (LGA) is a molded area array matrix package wh ich can be used in a socket or connected to the board using s older paste. The LGA package is identical in constr uction to the MAPBGA (Mold Array Process Ba ll Grid Array) or overmolded BGA (e.g. PBGA), except the BGA spheres are not attached.
Column Grid Array: A Modified COTS Approach for Area Array ...
www.sixsigmaservices.comColumn Grid Array: A Modified COTS Approach for Area Array Packaging of Military and Space Electronics William E. Davis And Russell T. Winslow
Ball Grid Array (BGA) Packaging
www.intel.coman Organic Land Grid Array (OLGA) substrate. In addition to the typical advantages of PBGA pack-ages, the FC-style H-PBGA provides multiple, low-inductance connections from chip to package, as well as, die size and cost benefits. By providing …
FOR IMMEDIATE RELEASE Press Release
www.semiconductorpackagingnews.comThis material can be used as an underfill for flip chip, chip scale package, ball grid array devices, package on package, and land grid array applications. It is also suitable for bare chip protection in a variety of advanced packages such as memory cards, chip carriers, hybrid circuits and multi-chip modules.
MIL-PRF-38535 Standard Microcircuits Hermetic and Non …
nepp.nasa.govflip-chip construction, in high-pin-count ceramic column grid array (CGA) packages. These products use tiny base electrode metal (BME) capacitors for signal integrity, and vented packages for thermal management. (e.g., Xilinx Virtex-4 FPGAs) o To address the manufacturability, test, quality, and reliability issues