Search results with tag "Complex chemistry amp the electroless copper plating"

Complex Chemistry & the Electroless Copper Plating Process

tional electroless copper plating solutions with formaldehyde as the reducing agent. 14-17 These plating solutions exhibit low deposi- tion rates because of the high formation constants of the cupric

  Solutions, Chemistry, Copper, Complex, Plating, Electroless, Plating solution, Complex chemistry amp the electroless copper plating