Transcription of 1 Form A Solid-State Relay - Vishay
1 VO14642AT, Semiconductors Rev. , 12-Jun-171 Document Number: 81646 For technical questions, contact: DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENTARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT form A Solid-State RelayDESCRIPTIONThe VO14642 is a high speed single channel normally open Solid-State Relay (SPST - 1 form A) in a DIP-6 package. The Relay is constructed as a multi-chip hybrid device. A high efficient infrared LED enables low forward current on the input side. On the output side high performance MOSFET switches provide a low RON and can be configured for AC/DC or DC only High speed SSR - ton/toff < 800 s Maximum RON Isolation test voltage 5300 VRMS Load voltage 60 V Load current 2 ADC configuration DIP-6 package Clean bounce free switching TTL / CMOS compatible input Available on tape and reel Material categorization.
2 For definitions of compliance please see Instrumentation Industrial controls Security Automatic measurement equipmentAGENCY APPROVALS UL1577 cUL - UL1577 DIN EN 60747-5-5 (VDE 0884-5) capable, consult sales representative for detailsNote Agency approvals are valid only for ambient temperature range -40 C to 85 C6S'SDC15243 ORDERING INFORMATIONVO14642 AxxTRPART NUMBERELECTR. VARIATIONPACKAGE AND REELPACKAGESMD-6, tape and reelVO14642 AABTRDIP-6, TubesVO14642 ATDIP-6 SMD-6VO14642AT, Semiconductors Rev. , 12-Jun-172 Document Number: 81646 For technical questions, contact: DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE.
3 THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENTARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. Functional operation of the device is not implied at these or any other conditions in excess of those given in the operational sections of this document. Exposure to absolute maximum ratings for extended periods of the time can adversely affect reliability(1)Refer to reflow profile for soldering conditions for surface mounted devices (SMD). Refer to wave profile for soldering conditions for through hole devices (DIP)ABSOLUTE MAXIMUM RATING CURVEFig.
4 1 - Load Current (AC/DC) vs. Temperature Note The thermal model is represented in the thermal network below. Each resistance value given in this model can be used to calculate the temperatures at each node for a given operating condition. The thermal resistance from board to ambient will be dependent on the type of PCB, layout and thickness of copper traces. For a detailed explanation of the thermal model, please reference Vishay 's thermal characteristics of optocouplers application noteABSOLUTE MAXIMUM RATINGS (Tamb = 25 C, unless otherwise specified)PARAMETERTEST CONDITIONSYMBOLVALUEUNITINPUTLED continous forward currentIF50mALED reverse voltageVR5 VLED power dissipationAt 25 CPdiss80mWOUTPUTDC or peak AC load voltageVL60 VLoad current (DC only)IL2 APeak load current (AC/DC)
5 T = 10 power dissipationAt 25 CPdiss250mWSSRT otal power dissipationPdiss330mWAmbient temperature rangeTamb-55 to +85 CStorage temperature rangeTstg-55 to +125 CSoldering temperature (1)t 10 s -50-250255075100 Load Current/A Ambient Temperature/ C DC mode AC/DC mode THERMAL CHARACTERISTICS PARAMETERTEST CONDITIONSYMBOLVALUEUNITM aximum LED junction temperatureAt 25 CMaximum output die junction temperatureAt 25 CThermal resistance, junction emitter to boardAt 25 C EB176 C/WThermal resistance, junction emitter to caseAt 25 C EC208 C/WThermal resistance, junction detector to boardAt 25 C DB67 C/WThermal resistance, junction detector to caseAt 25 C DC134 C/WThermal resistance.
6 Junction emitter to junction detectorAt 25 C ED310 C/WThermal resistance, case to ambient At 25 C CA2180 C/WVO14642AT, Semiconductors Rev. , 12-Jun-173 Document Number: 81646 For technical questions, contact: DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENTARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT Minimum and maximum values are testing requirements. Typical values are characteristics of the device and are the result of engineering evaluations. Typical values are for information only and are not part of the testing requirements PIN CONFIGURATIONELECTRICAL CHARACTERISTICS (Tamb = 25 C, unless otherwise specified)PARAMETERTEST forward current, switch turn-onIL = 1 A, VL V, t = 10 forward current, switch turn-offVL = 60 V, IL < 1 AIFoff50-- ALED reverse currentVR = 5 VIR--10 ALED forward voltageIF = 10 (AC/DC)IF = 10 mA, IL = 1 On-resistance (DC only)IF = 10 mA, IL = 2 Off-state leakage currentIF = 0 mA, VL = 60 VILEAK--1 ASWITCHING CHARACTERISTICS (AC/DC CONNECTION)
7 PARAMETERTEST timeIF = 10 mA, VL = 30 V, IL = 200 mAton-370800 sTurn-off timeIF = 10 mA, VL = 30 V, IL = 200 mAtoff-50800 sTurn-on timeIF = 10 mA, VL = 5 V, IL = 1 Aton-550- sTurn-off timeIF = 10 mA, VL = 5 V, IL = 1 Atoff-18- sTA CATCTJDTJETB EC EB DC DB BA DETA19996 PackageAC/DC configuration654321 AnodeCathodeDo not useLoadLoadDC only configuration654321 AnodeCathodeDo not use20545VO14642AT, Semiconductors Rev. , 12-Jun-174 Document Number: 81646 For technical questions, contact: DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENTARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT This SSR is suitable for safe electrical insulation only within the safety ratings.
8 Compliance with the safety ratings shall be ensured by means of protective circuitsFig. 2 - Safety Derating (input)Fig. 3 - Safety Derating (output)SAFETY AND INSULATION RATINGSPARAMETERTEST CONDITIONSYMBOLVALUEUNITC limatic classificationAccording to IEC 68 part 1 40 / 085 / 21 Pollution degreeAccording to DIN VDE 01092 Comparative tracking index Insulation group IIIaCTI175 Maximum rated withstanding isolation voltageAccording to UL1577, t = 1 min VISO5300 VRMSM aximum transient isolation voltageAccording to DIN EN 60747-5-5 VIOTM8000 VpeakMaximum repetitive peak isolation voltageAccording to DIN EN 60747-5-5 VIORM890 VpeakIsolation resistanceTamb = 25 C, VIO = 500 V RIO 1012 Tamb = 100 C, VIO = 500 V RIO 1011 Tamb = TS.
9 VIO = 500 V RIO 109 Output safety power PSO400mWInput safety current ISI150mAInput safety temperature TS165 CCreepage distance 7mmClearance distance 7mmInsulation thickness DTI mm20991-1 InputOutput10 %90 % ms0501001502002503003504004500255075 100 125 150 175 200 Maximum Safety Output Power (mW)Ambient Temperature ( C)Output Power PSO0204060801001201401600 255075100125150175200 Maximum Safety Input Current (mA)Ambient Temperature ( C)Input Current ISIVO14642AT, Semiconductors Rev. , 12-Jun-175 Document Number: 81646 For technical questions, contact: DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE.
10 THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENTARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT CHARACTERISTICS (Tamb = 25 C, unless otherwise specified)Fig. 4 - Forward Voltage vs. Forward CurrentFig. 5 - LED Leakage Current vs. Ambient TemperatureFig. 6 - Leakage Current vs. TemperatureFig. 7 - LED Voltage vs. TemperatureFig. 8 - LED Forward Current for Switch Turn-On vs. TemperatureFig. 9 - On-Resistance vs. 1 10 100 VF - Forward Voltage (V) IF - Forward Current (mA) Tamb = 25 CTamb = +85 C Tamb = -55 C -55-35-15525456585 LED Leakage Current (nA) Tamb - Ambient Temperature ( C) VR = 11V 0 5 10 15 20 25 30 35 40 -55 -35 -15 5 25 45 65 85 Leakage Current (nA) Temperature ( C) VLoad = 60 V -55 -35 -15 5 25 45 65 85 LED Voltage (V) Temperature ( C)
