2016 Quality and Reliability Manual

1 2016 Quality and Reliability Manual 1623 Buckeye Road, Milpitas, CA, 95035 Tel: iContents Content Page Chapter 1 Quality Management 1 Quality Policy 1 Quality Organization 1 ISO 9001 Year 2008 Revision 2 Quality Systems 5 Process Map 5 Advanced Product Quality Planning 6 Quality Assurance in the Project Approval Stage 8 Quality Assurance in Design Development Stage 8 Product Development

2 And Design 8 Design Review 8 Product Release 9 Production Part Approval Process (PPAP) 9 Quality Assurance in Production Stage 9 Wafer Processing 9 Assembly Process Technology 12 Testing 14 Quality Assurance of Product Shipping 20 Monitoring Data for AOQL 20 Customer Complaint 21 ISSI RMA Process 21 RMA Flow Chart 22 RMA Trend Chart 23 Change Control 23 e-CAR 25

3 Corrective Action 25 Preventive Action 25 FMEA 27 Chapter 2 Management on Subcontractors 30 Task Force 30 ii Content Page Methodology 30 Quality Rating/Audit 31 Supplier Relationship 32 Subcontractor Process Control 32 Production Line ESD Control/Management 33 Chapter 3 Product Reliability 34 Reliability Assurance 34 Product/Process Qualification 34 Qualification Test Method and Acceptance Criteria 39 Semiconductor Device Failure Region 46 Failure Rate Calculation 47 Philosophy of Reliability Monitor 53 Reliability Test Equipment 55 Device Related Test Data 60 Package Related Test Data 64 Lead-Free Package Roadmap 65 Process Average Testing (PAT), Statistical Yield Analysis (SYA)

4 And Junction Verification Test (JVT) 66 Chapter 4 Failure Analysis 72 Establishment of Failure Analysis (FA) Laboratory 72 Electrical Failure Analysis (EFA) Laboratory 72 Assembly Engineering and Chemical Laboratory 72 Physical Failure Analysis (PFA) Laboratory 72 Failure Analysis Function 73 Failure Analysis Flow 74 Failure Analysis Instruments 76 Chapter 5 Environmental Management 81 Environmental Policy 81 Environmental Management Quality Assurance 82 ISO14001 Certificate - Taiwan 82 Environmental Management Organization 84 Environmental Substances Management 84 Legislation and SONY Policy 84 iiiContent Page

5 Green Partner Certification 86 Industry Definition of Lead-free & Halogen-free 87 Product Composition 93 Lead-free Solution 94 Halogen-free Solution 97 Pb-free/Halogen-free Evaluation/Qualification Information 97 Current Status 100 Solder Heat Resistance for PCBA (PC Board Assembly) 101 Lead Time from Ordering to Delivery 101 Distinguishing Mark of Lead-free and RoHS Compliance Package 101 IR Re-Flow Temperature Profile for Lead-free Package 102 Recommended Storage Condition 103 ISSI Declaration of Compliance 103 iv Appendices (Available upon request from Marketing)

6 Contents Page 1 Milestones and Awards 114 2 Process Data Table 1-1 AOQL (SRAM) 115 Table 1-2 AOQL(DRAM) 115 Table 1-3 IQC/Visual Mechanical LRR Trend Chart 116 Table 1-4 OQC LRR Trend Chart 116 3. RMA Data Table 1-5 RMA s by Month 117 Table 1-6 RMAs by Product Type 117 4 Device Related Test Data 118 Table 3-7 FIT Value for product of SRAM, DRAM, and ANALOG 118 Table 3-8 High Temperature Operating Life Test 123 Table 3-9 Electrostatic Discharge (ESD)

7 And Latch-up Tests 145 Table 3-10 Data Retention 159 Table 3-11 Endurance Cycling 160 5 Package Related Test Data 162 Table 3-12 Pre-condition Test 162 Table 3-13 Highly Accelerated Stress Test 193 Table 3-14 Temperature Cycling Test 222 Table 3-15 Pressure Cooker Test 253 6 Monitor Qual Table 3-16 Device Monitor Qual 168 Hrs HTOL 284 7 Failure Analysis Cases 296 Example of FA Case - SRAM ( m, 256K) 296 Example of FA Case - SRAM ( m, 1M) 297 Example of FA Case - DRAM ( um, 4M) 299 Example of FA Case DRAM( um, 4M) 301 Construction Analysis 303 72 nm Double Data Rate DRAM (K038) 303 65 nm 6T SRAM (8159) 305 55 nm 6T SRAM (9090)

8 307 1 Chapter 1 Quality Management Quality Policy ISSI Management and all other team members are committed to: - Understand and satisfy customer expectations - Provide defect-free products and outstanding service cost effectively - Continuously improve ours and our partners methods and processes - Training that enables us to do things right - Be the best in class in everything we do Quality Organization ISSI headquarters is located at 1623 Buckeye Road, Milpitas, California, USA where the corporate policies and programs are determined and applied to world-wide operations.

9 The Taiwan facility is located in the Science-Based Industrial Park, Hsin-Chu, Taiwan, The China office is located in Zhangjiang Hi-Tech Park, Pudong New Area, Shanghai and in Software Park, Xiamen. Operations in Taiwan and China consist primarily of research and development activities and Foundry and Subcontractor management. Subcontracted operations include Wafer Fabrication, Assembly and Final Test. Many of these subcontractors are located in Taiwan and China and are managed by the Taiwan and China Quality Organization.

10 The Quality Organization is outlined in Figure 1-1. Quality and Reliability Assurance DivisionUSA Quality AssuranceQuality Assurance DepartmentChina Quality AssuranceJapan Quality AssuranceFailure Analysis DepartmentReliability Department ISO 9001 Doc Control Customer Audit/Survey Internal Audit RMA Handling CAR Report/ Follow up PIQC/OQC/ WQC Subcontractor Management Subcontractor Audit/Survey RMA Analysis Customer Technical Support Product Qualification Reliability Monitor Package Failure