3D SiP(System-in-Package) 기술 동향

1 1367 2008. 10. 8. 14 3D SiP(System-in-Package) * ** ** ** SiP(System-in-Package) , . SiP , . SiP MCP(Multichip Package), BoB(Board-on-Board), SiP MCP, BoB SiP . I. (Ubiquitous Sensor Network: USN) , , , . MCM (MultiChip Module) , KGD(Known Good Die).

2 , MCM SiP (System-in-Package) 2 3 . MCM SiP * ETRI / ** ETRI / I. II. SiP III. IV. 15 burn-in KGD , bare die , , , (time-to-market) SiP . , SiP , , MP3 USN , , , [1],[2]. SiP SiP . Tummala SiP IC SoP (System-on-Package) RF, , IC [2].

3 ITRS(International Technology Roadmap for Semiconductors) (SiP : , [3]). SiP 3D SiP interconnection , (delay), , , . SoC(System-on-Chip) SiP , SiP (CAD) , , [4]. 3D SiP MCP, BoB, SiP SiP.

4 II. SiP 1. MCP MCP ISM(Internal Stack Module) 1367 2008. 10. 8. 16 PoP(Package-on-Package) [5]. MCP . ( 1 (a)) ISM [1]. ISM SDRAM flash, DSP+SRAM+Flash, ASIC+ , + [1]. 2006 8Gb 16 16 Gbyte 64 FBGA(Fine-Pitch Ball Grid Array) ISM . KGD burn-in PoP . PoP bare die , SRAM+Flash, DDR DRAM . ( 1) (b), (c), (d) PoP . (b) [1], (c) [6], (d) PoP [7].

5 PoP , , I/O PoP [8]. MCP . JEDEC JC- 63 ISM PoP . MCP {Flash, PSRAM, SRAM LPDRAM(SDR/DDR)}, {Flash, SRAM, LPDRAM(SDR/DDR)}, {x16 NOR/ NAND Flash, PSRAM, SRAM} [9]. , (c) folded package[6] (d) uni-stack package[7] ( 1) MCP (a) ISM[1] (b) PoP[1] 17 MCP [10]. ( 2 (a)) x16/x32 LPDRAM(SDR/DDR) x8 eMMC Flash LFBGA(Low-profile Fine-pitch ball grid array) MCP ball map . ball map SSN(Simultaneous Switching Noise), SI(Signal Integrity), crosstalk MCP MCP.

6 ( 2 (b)) . interposer . ( 2 (b)) . SiP . , MCP , , . (a) x16/x32 LPDRAM (SDR/DDR) x8 eMMC Flash ball map (b) x16 NAND ( 2) JEDEC 153-Ball LFBGA-Active MatrixTop view, Ball Side Down141312111098765432114131211109876543 21 ABCDEFGHJKLMNPABCDEFGHJKLMNPX16/X32 DRAM ONLYX32 DRAM ONLYeMMC ONLYNO CONNECTDO NOT NCNCNCNCNCD-VDDQD-VDDQD-VDDQD-VDDQD-VDDQ D-VDDQD-VDDQD-VDDQD-VSSQD-VSSQD-VSSQD-VS SQD-VSSQD-VSSQD-VSSQD-VSSQD-DQ16D-DQ21D- DQ20D-DQ17D-DQ23D-DQ22D-DQ19D-DQ16D-DM2D -VDDD-VDDD-VDDD-VDDD-VSSD-VSSD-VSSD-VSSM -VSSD-DQ15D-DQ14D-DQ13D-DQ12D-DQ11D-DQ10 D-DQ9D-DQ8D-DQ7D-DQ6D-DQ5D-DQ4D-DQ3D-DQ2 D-DQ1D-DM1D-VDDQD-DQS2D-CLKD-CLK#D-DQS1D -DQS3D-DM3D-DMQD-DQS0D-VDDD-DQ24D-DQ25D- DQ26D-DQ27D-DQ28D-DQ29D-DQ30D-DQ31M-VDDM -VSSM-VDDVSSVSSM-VDDM-VDDD-DQ10M-CLKM-VS SQM-VCSQM-VCDQM-VCDQM-VSSQM-VSSQM-CMDM-V DDQM-VDDQM-VDDQM-VDDQM-VSSQM-VSSIDAT7 DAT2 DAT6 DAT1 DAT5 DAT0 DAT4 DAT3D-A4D-TQD-A7 D-A8 D-A9D-A6 D-A11 D-A13D-WE#D-A10D-A1 D-A2 D-A3D-CEO#D-RAS#D-A7

7 D-A8 D-A9D-CAS#D-CE1#D-VSSD-A0D-A5D-A12D-CKE0 1367 2008. 10. 8. 18 2. BoB USN BoB(Board-on-Board) . , RF, , , , IC . , . < 1> IZM Fraunhofer eGrain , [11],[12]. 10 10mm2 1 Mbps . QFN bare die FR4 . wave soldering , , folded flexible . , , . IZM 5 5 5mm3.

8 IMEC eCube BoB 14 14 t12 mm3 [13]. 114 CSP(Chip Scale Package) . , EEG(Electroencephalography) ASIC < 1> IZM BoB 3D Inter connectInsde interconnections Sidewall Interconnections Folded Flexible Substrate Edge Length 10mm 10mm 10mm Chip Set TI MSP430F149 Nordic nRF2401 Atmel ATMega 128L Chipcon CC1100 Atmel ATMega 128L Chipcon CC1100 Antenna Embedded Antenna External Wire Mini-loop Antenna Range ~3m(1 Mbits) 4~75m(500kbits) 2~30m(38kbits) Energy Capacity 120mWh(Ag2o) 400mW(ZnO2) 120mWh(Ag2o) 400mW(ZnO2) 75mWh(Ag2o) 19 , bare die gold stud bump .. IMEC (eCube).

9 (CAD tool), interconnection, ( , , RF ), . ( 4) [14]. , . , interconnection ( , ), , , ( , ) , , , , , (constraint) ( 3) IMEC (a) (b) (c) [14] ( 4) L0 L1 L2 L2L0L1 1367 2008. 10. 8. 20 . interconnection ( 1) MCP , , , , interconnection.

10 , RF . , , , , , [11],[12]. SiP . 3. SiP 2006 wafer level stack (Thru Silicon Via: TSV) 50 , 2 Gbit NAND flash 16 Gbit [15]. IC TSV . , NAND , DRAM IC (on-chip delay), litho , [16] , < 2> SiP Wafer thinning Grinding, CMP(Chemical Mechanical Planarization), Wet etching Plasma etching Wafer handling Wax, glues, liquid resists Dry film laminated Electrostatic mobile carrier Via drilling Laser drilling, DRIE(Deep Reactive Ion Etching) Via filling Electroplating, CVD(Chemical Vapor Deposition) Wafer/chi bonding Glass frit, metal-to-metal, eutectic, adhesive, oxide bonding 21.