(AUTOMATIC VISUAL INSPECTION) for Probe …

1 PRESENTSU sing AVI (AUTOMATIC VISUAL INSPECTION) for Probe Mark InspectionandImplementing AVIinto theTest Floor Production ProcessMamo Matsushime Texas Instruments, HijiMike ClaySTI, 12, 2000 SemiconductorTechnologies &InstrumentsJune 12, 20002 Part One:Using AVI for Probe Mark InspectionJune 12, 20003 OUTLINE! Probe Mark Defects Detectable!Bond Pad Damage Detectionas qualified at CM I!capture rate and range !Bond Pad Damage Detectionas quantified at T I!accuracy correlationJune 12, 20004 Probe Mark Defects Detectable with AVI:Edge ExcursionJune 12, 20005 Probe Mark Defects Detectable with AVI:Pad DiscolorationJune 12, 20006 Probe Mark Defects Detectable with AVI:Pad DamageJune 12, 20007 Bond Pad Damage Detection:As Qualified at Cypress Semiconductor, MinnesotaSample=289 dieMax areapass/failsettingManualcountAVIC ountFail tocaptureFalsedefects% fail tocapture% false capture30%3939000% : DIE LEVEL inspection ** Bond pad level Probe mark area inspection accuracy is Range determined bytesting one borderline bond pad (56 pixels = 25% area probed) 100 %Accuracy and Repeatability for Percentage of Pad Damage:Capture Rate and Range[These data provided by Dane Christian, Cypress Semiconductor]June 12, 20008 Bond Pad Damage Detection:As Quantified at Texas Instruments, DallasAccuracy Correlation.

2 AVI, Dallas Wafer Test Site and Off-Shore Assembly Site[These data provided by Jerry Broz, Texas Instruments - Dallas]June 12, 20009 Bond Pad Damage Detection:As Quantified at Texas Instruments, DallasAccuracy Correlation: AVI, Dallas Wafer Test Site and Off-Shore Assembly Site[These data provided by Jerry Broz, Texas Instruments - Dallas]June 12, 200010 Bond Pad Damage Detection:As Quantified at Texas Instruments, DallasAccuracy Correlation: AVI, Dallas Wafer Test Site and Off-Shore Assembly Site[These data provided by Jerry Broz, Texas Instruments - Dallas]June 12, 200011 Part Two:Implementing AVI into theTest Floor Production ProcessJune 12, 200012 AVI System WAV-100012 June 12, 200013 PURPOSE TO IMPLEMENT AVI - To provide AVI(Automated VISUAL inspection ) systemwithin TIJ Hiji to detect accurately VISUAL anomaliesdefect on patterned wafer with reasonable Brake through VISUAL Quality Lot assurance concept onFAB. Products.

3 (Wafer level Chip level assurance)- Productivity improvement compared with humaninspection with metal microscope. - Short operator training Full time operate possibility.( )J-1234567-XX-YYXXXXXXXXXXXLot Level AssuranceWafer AssuranceChip Assurance02/05/99 MM 072/6232As of 04/25/00 MM13 June 12, 200014 TIJ Hiji Wafer AVI System Case study : Defects escape VS Crime Lot Pass rate Defect % in LotCrimeLarge100%QC Pass LotCrime number 14 June 12, 200015 TIJ Hiji Wafer AVI System From Assembly line Defect AnalysisDefect size (um)Defect Q tyLargeHighCan be detected over 90% defect,if we screening more than targetedsize 12, 200016 TIJ Hiji AVI System SYSTEM DESCRIPTION/DESIGN- Automated Wafer Handling Platform. (Load/Unload, Align,Index or Position)- Accurate repeatability. (Over 90%)- Speedy inspection time. (Approx. 3 Wafer 100% Inspect.)- Minimum 10um defect size detect. - automatic Defect Categorization is future of 04/25/00 MM16 June 12, 2000 Hiji AVI Current Methodology -1/2 CapabilityFunction - Defect detection 4 ~ 5um or more >90% repeatability.

4 (Use Sub-Pixel test)- High speed VISUAL inspection . (Approx. 90s /6 W, (225s/6 W with Load/UnLoad))- Multi dies(x2, x3 or xN) and Sub dies(1/2, 1/3 or 1/N) inspect 100% chips/Wafer inspection , random sampling inspection with set AQL Wafer handling size from 5 to 8 .- Motorized optics (SQ 200 mil - 500mil).- Offline ink/Ink Less. - Defect area and size identification and Bond Pad Auto training and auto automatic lot number recognize by Device program load for Prober, Mapper or Vision Auto focus, auto light level Wafer Alignment, reference chip location recognize. - Generate sampling chips for reference chip image shots. 01/18/99 MM- 03/6232As of 04/25/00 MM17 June 12, 200018 Hiji AVI Current Methodology -2/2 CapabilityProgramming - Process area selection or setting- Minimum detect size setting in process area. - Ink chip screening or skip Light level adjustment setting for inspection VS reference Set Magnification(SQ 200 mil - 500mil).

5 - Specific area setting with filter(set minimum detect size). - Set detect sensitivity(Low, Mid, Hi., 1 - 3 STD DEV.)Test accuracy technique- Particle wipe off Filtered Air(N2) Retest Auto stop for abnormal percentage defect AVI fail location display(Wafer map, Chip map) or defect size,.- Review defect location and defect identify by color capture - Generate overlay, wafer map. (YAKITORI MAP)- Auto print report at any lot operation end .01/18/99 MM- 03/6232As of 04/25/00 MM18 June 12, 200019 INK chip chip chip chip VISUAL failVisual failVisual failVisual failAVI System Multi/Sub. Chip inspectionMulti chips inspectionDivided chip part inspection for big chipExExExEx 3x3 chips/1 shot1/3 chip area/1 shot 19 June 12, 200020 Example AVI Lot report20 June 12, 2000 AVI Report Example Each Wafer21 June 12, 2000 AVI Report exampleLot Over all YAKITORI MAP 22 June 12, 2000 Void Pattern De focus patternMissing PatternAVI Detect defects exampleParticle23 June 12, 2000 Inking TimeInspection TimeWafer Handling Chip InspectionInk lessSampling ChipInspectionAVI inspection Time / Wafer Lot010002000300040005000600070008000 About 2 1 Lot = 6 24 WafersInk Less = 350 SQ MIL Shot, 3 Wafers/Lot=100%24 June 12, 2000 AVI inspection Defects AnalysisBefore M/P Test on 104227 Device85%7%3%1%4% Material(Metallic)

6 Grease ContaminationOil mist ContaminationDo not IdentifiedEvaluation Lot = 2, n = 6709/30/98 MM 072/623225 June 12, 200026 Hiji AVI FutureMethodology Ink less(Wafer Map) data link- Electrical ink and data link to data transfer by E- net(No ink operation).- Networking connection. Advanced AVI system-3 dimension (X,Y or Z) inspect. (Bump, Petal, Nozzle)- Bond Pad Speed upFlash shutter camera inspection alignment work for Prober and Detection level (More small size defect) Intelligent AVI System-Reduce foreign material on wafer or ignore abnormality defect Automated Work station.(from Wafer ID)-Auto device program of 04/25/00 MM26 June 12, 2000QC/OG V/M DATA (ppm)0200040006000800010000120001Q'972Q' 973Q'974Q'971Q'982Q'983Q'984Q'98 Jan-99 Feb-99 Mar-99 Apr-99 May-99 Jun-99 Jul-99 Aug-99 Sep-99 Oct-99 Nov-99 Dec-99 DateDefect ABCI mplement AVI#1 Implement AVI#227 June 12, 2000 Hiji AVI (Auto VISUAL INSPECTION) futureplan 1 AVI System Clean room application AVI Network connection.

7 2nd AVI Ink-less implement. Sampling inspection . Advanced AVI. 3 dimension inspect. Joint and parallel operation with M/P test Intelligent AVI06/25/99 MM 03-6232`98 `99 `00 `01 `02 `03 `04As of 04/25/00 MM28