1 Technical Data 2621 Effective January 2016 Supersedes August 2013 Product description Radial leaded, time delay with low breaking capacity Designed to IEC60127-3 Sheet 4 Plastic cap and base, flammability UL 94V0 Protects against harmful overcurrents in primary and secondary applications Small rectangular-leaded design utilizes less board space High frequency vibration: MIL-STD-202F, Method 201A HALOGEN free, lead free, RoHS compliantApplicationsPrimary and secondary circuit protection: Power supplies Notebooks and laptops Appliances and white goods Lighting ballasts Power adapters Set top boxes LED/LCD televisions and displays Air conditioners Battery chargersAgency information UL Recognition: File E19180, Guide JDYX2/JDYX8 VDE: 40015513 CQC: 08012025533 PSE: JET 1641-31007-1008 (1 A 5 A) JET 1641-31007-1009 ( A) KC: SU05011-8001 (400 mA 800 mA) SU05011-8002 (1 A A) SU05011-8003 ( A A) Semko.
2 1516697 (630 mA, 1 A 4 A) 1124941 (500 mA, 800 mA, 5 A, A)Ordering Use ordering number (see page 6 for details) Packaging suffixes -AP (1 000 parts Ammo pack, Pitch = ) -BK (200 parts in a polybag, Lead L = ) -BK2 (200 parts in a polybag, Lead L = 21 )SS-5250 V Subminiature, radial leaded, time-delay fusesPbHALOGENHFFREE2 Technical Data 2621 Effective January 2016SS-5250 V Subminiature, radial leaded, time-delay fuses maximums10lnminimumms10lnmaximumms200 mA A60240010150320150 Product specifications Part numberCurrentrating(A)Voltagerating(VAC )Interrupting rating at rated voltage (50 Hz) (AAC)Typical DC coldresistance2 (m )Typical melting3 I2t (A2s)Typical voltage drop4 (mV)
3 CURusKCVDECQCSEMKOPSE+ 200 mA to A measured at 35 A, 95% - 100% of PF on AC. 4 A A measured at 10 times of rating current 95% - 100% of PF on Typical cold resistance measured at < 10% of rated current3. I2t value is measured at 10In DC4. Typical voltage drop measured at 20 C ambient temperature and rated currentDimensions and packaging mm [in]3 Technical Data 2621 Effective January 2016SS-5250 V Subminiature, radial leaded, time-delay fuses vs. current curveTime (s)4 Technical Data 2621 Effective January 2016SS-5250 V Subminiature, radial leaded, time-delay fuses vs.
4 Time curveI2t (A2s)5 Technical Data 2621 Effective January 2016SS-5250 V Subminiature, radial leaded, time-delay fuses dataOperating temperature: -40 C to +125 C with proper correction factor applied Storage temperature: -10 C to 40 C Solderability: EIA-186-9E Method 9 High frequency vibration test: Withstands 10-55 Hz per MIL-STD-202F, Method 201 AEndurance test: IEC60127-3/4 Temperature derating curveNormal Operating Temperature: +25 C 2 C6 Technical Data 2621 Effective January 2016SS-5250 V Subminiature, radial leaded, time-delay fuses codesPart number-AP option-BK option-BK2 codesThe ordering code is the part number replacing the.
5 With a - plus adding the packaging suffixes -AP (1 000 parts Ammo pack, Pitch = ) -BK (200 parts in a polybag, Lead L = ) -BK2 (200 parts in a polybag, Lead L = 21 )EatonElectronics Division1000 Eaton BoulevardCleveland, OH 44122 United 2016 EatonAll Rights ReservedPrinted in USAP ublication No. 2621 BU-MC16007 January 2016 Eaton is a registered other trademarks are property of their respective Data 2621 Effective January 2016SS-5250 V Subminiature, radial leaded, time-delay fuses Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company.
6 Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this solder profile Reflow soldering not recommendedReference EN 61760-1:2006 Profile FeatureStandard SnPb SolderLead (Pb) Free SolderPreheat Temperature min.
7 (Tsmin)100 C100 C Temperature typ. (Tstyp)120 C120 C Temperature max. (Tsmax)130 C130 C Time (Tsmin to Tsmax) (ts)70 seconds70 secondsD preheat to max Temperature150 C C temperature (TP)*235 C 260 C250 C 260 CTime at peak temperature (tp)10 seconds max 5 seconds max each wave10 seconds max 5 seconds max each waveRamp-down rate~ 2 K/s min ~ K/s typ ~5 K/s max~ 2 K/s min ~ K/s typ ~5 K/s maxTime 25 C to 25 C4 minutes4 minutesManual solder 350 C, 4-5 seconds (by soldering iron), generally manual hand soldering is not Time TsminTsmax Tstyp Tp tp First Wave Second Wave Preheat area Cool down area