IBM Power 770 and 780 Technical Overview and …

1 CoverIBM Power 770 and 780 Technical Overview and IntroductionAlexandre Bicas CaldeiraCarlo CostantiniSteve HarnettVolker HaugCraig WatsonFabien WillmannFeatures the 9117-MMC and 9179-MHC based on the latest POWER7 processor technologyDescribes MaxCore and TurboCore for redefining performanceDiscusses Active Memory Mirroring for HypervisorInternational Technical Support OrganizationIBM Power 770 and 780 Technical Overview and IntroductionDecember 2011 REDP-4798-00 Copyright International Business Machines Corporation 2011. All rights to Government Users Restricted Rights -- Use, duplication or disclosure restricted by GSA ADP ScheduleContract with IBM Edition (December 2011)This edition applies to the IBM Power 770 (9117-MMC) and Power 780 (9179-MHC) Power Systems : Before using this information and the product it supports, read the information in Notices on page vii. Copyright IBM Corp. 2011. All rights .. viiTrademarks .. viiiPreface.

2 IxThe team who wrote this paper .. ixNow you can become a published author, too! .. xiComments welcome.. xiStay connected to IBM Redbooks .. xiiChapter 1. General description .. Systems Overview .. IBM Power 770 server .. IBM Power 780 server .. Operating environment .. Physical package .. System features .. Power 770 system features .. Power 780 system features .. Minimum features .. Power supply features .. Processor card features .. Summary of processor features .. Memory features .. Disk and media features .. I/O drawers .. PCI-DDR 12X Expansion Drawers (#5796) .. 12X I/O Drawer PCIe (#5802 and #5877) .. EXP 12S SAS Drawer.. EXP 24S SFF Gen2-bay Drawer .. I/O drawers and usable PCI slot .. Comparison between models .. Build to Order .. IBM Editions .. Model upgrade .. Hardware Management Console models .. System racks.. IBM 7014 model T00 rack.

3 IBM 7014 model T42 rack .. IBM 7014 model S25 rack.. Feature number 0555 rack .. Feature number 0551 rack .. Feature number 0553 rack .. The AC Power distribution unit and rack content .. Rack-mounting rules .. Useful rack additions.. 33 Chapter 2. Architecture and Technical Overview .. The IBM POWER7 processor .. POWER7 processor Overview .. 41iv IBM Power 770 and 780 Technical Overview and POWER7 processor core .. Simultaneous multithreading.. Memory access .. Flexible POWER7 processor packaging and offerings .. On-chip L3 cache innovation and Intelligent Cache .. POWER7 processor and Intelligent Energy .. Comparison of the POWER7 and POWER6 processors .. POWER7 processor cards .. Two-socket processor card .. Four-socket processor card .. Processor comparison .. Memory subsystem .. Fully buffered DIMM .. Memory placement rules.. Memory throughput .. Active Memory Mirroring.

4 Capacity on Demand.. Capacity Upgrade on Demand (CUoD).. On/Off Capacity on Demand (On/Off CoD).. Utility Capacity on Demand (Utility CoD) .. Trial Capacity On Demand (Trial CoD) .. Software licensing and CoD .. CEC Enclosure interconnection cables .. System bus .. I/O buses and GX++ card .. Flexible Service Processor bus.. Internal I/O subsystem .. Blind-swap cassettes .. System ports .. PCI adapters .. PCIe Gen1 and Gen2 .. PCI-X adapters .. IBM i IOP adapters .. PCIe adapter form factors .. LAN adapters .. Graphics accelerator adapters .. SCSI and SAS adapters .. iSCSI adapters .. Fibre Channel adapter .. Fibre Channel over Ethernet .. InfiniBand Host Channel adapter .. Asynchronous adapter .. Internal storage .. Dual split backplane mode .. Triple split backplane .. Dual storage IOA configurations .. DVD .. External I/O subsystems.

5 PCI-DDR 12X Expansion drawer .. 12X I/O Drawer PCIe .. Dividing SFF drive bays in 12X I/O drawer PCIe .. 12X I/O Drawer PCIe and PCI-DDR 12X Expansion Drawer 12X cabling .. 12X I/O Drawer PCIe and PCI-DDR 12X Expansion Drawer SPCN cabling .. 91 Contents External disk subsystems .. EXP 12S Expansion Drawer .. EXP24S SFF Gen2-bay Drawer .. TotalStorage EXP24 disk drawer and tower .. IBM TotalStorage EXP24 .. IBM System Storage .. Hardware Management Console .. HMC functional Overview .. HMC connectivity to the POWER7 processor-based systems .. High availability using the HMC .. IBM Systems Director Management Console .. Operating system support .. Virtual I/O Server .. IBM AIX operating system .. IBM i operating system .. Linux operating system .. Java supported versions .. Boosting performance and productivity with IBM compilers .. Energy management .. IBM EnergyScale technology.

6 Thermal Power management device card.. 117 Chapter 3. Virtualization.. Power Hypervisor .. Power processor modes .. Active Memory Expansion.. PowerVM.. PowerVM editions .. Logical partitions (LPARs).. Multiple Shared Processor Pools .. Virtual I/O Server .. PowerVM Live Partition Mobility .. Active Memory Sharing .. Active Memory Deduplication .. N_Port ID virtualization .. Operating system support for PowerVM .. POWER7 Linux programming support .. System Planning Tool .. 150 Chapter 4. Continuous availability and manageability .. Reliability .. Designed for reliability.. Placement of components .. Redundant components and concurrent repair.. Availability .. Partition availability priority .. General detection and deallocation of failing components .. Memory protection .. Active Memory Mirroring for Hypervisor .. Cache protection .. Special uncorrectable error handling.

7 PCI enhanced error handling .. POWER7 I/O chip freeze behavior .. 168vi IBM Power 770 and 780 Technical Overview and Serviceability .. Detecting .. Diagnosing .. Reporting .. Notifying .. Locating and servicing .. Manageability .. Service user interfaces .. IBM Power Systems firmware maintenance .. Electronic Services and Electronic Service Agent .. Operating system support for RAS features .. 190 Related publications .. 193 IBM Redbooks .. 193 Other publications .. 193 Online resources .. 194 Help from IBM .. 195 Copyright IBM Corp. 2011. All rights information was developed for products and services offered in the IBM may not offer the products, services, or features discussed in this document in other countries. Consult your local IBM representative for information on the products and services currently available in your area. Any reference to an IBM product, program, or service is not intended to state or imply that only that IBM product, program, or service may be used.

8 Any functionally equivalent product, program, or service that does not infringe any IBM intellectual property right may be used instead. However, it is the user's responsibility to evaluate and verify the operation of any non-IBM product, program, or service. IBM may have patents or pending patent applications covering subject matter described in this document. The furnishing of this document does not give you any license to these patents. You can send license inquiries, in writing, to: IBM Director of Licensing, IBM Corporation, North Castle Drive, Armonk, NY 10504-1785 following paragraph does not apply to the United Kingdom or any other country where such provisions are inconsistent with local law: INTERNATIONAL BUSINESS MACHINES CORPORATION PROVIDES THIS PUBLICATION "AS IS" WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF NON-INFRINGEMENT, MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. Some states do not allow disclaimer of express or implied warranties in certain transactions, therefore, this statement may not apply to you.

9 This information could include Technical inaccuracies or typographical errors. Changes are periodically made to the information herein; these changes will be incorporated in new editions of the publication. IBM may make improvements and/or changes in the product(s) and/or the program(s) described in this publication at any time without notice. Any references in this information to non-IBM websites are provided for convenience only and do not in any manner serve as an endorsement of those websites. The materials at those websites are not part of the materials for this IBM product and use of those websites is at your own risk. IBM may use or distribute any of the information you supply in any way it believes appropriate without incurring any obligation to performance data contained herein was determined in a controlled environment. Therefore, the results obtained in other operating environments may vary significantly. Some measurements may have been made on development-level systems and there is no guarantee that these measurements will be the same on generally available systems.

10 Furthermore, some measurement may have been estimated through extrapolation. Actual results may vary. Users of this document should verify the applicable data for their specific environment. Information concerning non-IBM products was obtained from the suppliers of those products, their published announcements or other publicly available sources. IBM has not tested those products and cannot confirm the accuracy of performance, compatibility or any other claims related to non-IBM products. Questions on the capabilities of non-IBM products should be addressed to the suppliers of those information contains examples of data and reports used in daily business operations. To illustrate them as completely as possible, the examples include the names of individuals, companies, brands, and products. All of these names are fictitious and any similarity to the names and addresses used by an actual business enterprise is entirely coincidental. COPYRIGHT LICENSE:This information contains sample application programs in source language, which illustrate programming techniques on various operating platforms.