Orchestrating Packaging Technologies for an Extra …

1 Orchestrating Packaging Technologies for an Extra Sensory WorldJean-Marc YannouChristophe ZinckEddie ChengVincent K. LiaoAlex ChanNicole Group ASE Group. All rights throughout this presentation1 Supply chainSystem-in-a-PackageDesign, Manufacturing, Packaging and testMEMS & SensorsIntegrationThe Internet of Things Development kitStandardizationMotionEnvironmentalsen sors ASE Group. All rights IoT: integration a building block development kit cost and small size with SiPand advanced MEMS packaging2 ASE Group. All rights Internet of Things : perspectivesThe next big thing in the industry?Courtesy of Cisco ASE Group. All rights UnitsMainframeMillions UnitsPC (PM)350M+ UnitsCell Phone (PP) + UnitsSmartComputing (PMP)10B+ UnitsInternet of Things (IOT) (PMMP)100B+ UnitsExponential Connectivity & Big Data 1970s1980s1990s2000s2010sLong TailWe are hereVolume Paradigm: 10X in 10Y, accelerating2020s4 ASE Group.

2 All rights is a not a market, it s a tech trendCourtesy of Beecham Research ASE Group. All rights Group s IoT & MEMS/sensors vision The IoT might well be the next big thing in the electronics industry with trillions of components per year, but it won t happen everywhere nor at the same time Each IoT module will carry at least one MEMS and/or sensor For this to happen the following conditions must be business case on each model alignment / standardization on each market protocol standardization optimization of the module hardware6 ASE Group. All rights Hardware integration challenges7 ASE Group. All rights IoT modules by the billions8 Connectivity IC withintegratedantennaPower management ICBattery and energy scavengingMicro-controllerSensor(s)Auton omousCost EffectiveMiniaturePlug & play ASE Group.

3 All rights is an SiPModule?SiPmodule is a package that contains an electronic system or sub-system and is miniaturizedthrough IC assembly PackageElectronic System FunctionalityIC Assembly Technology ASE Group. All rights IoT modules by the billions Not a single player can do it all: partnership needed for fast and cost effective plug and play design and manufacture Multi-partner SiP has always been an issue because of the so-called known good die liability issue,but it has theability to make itsmall and costeffective Multiple SiPs per IoT module will be needed in the first place, for RF and for sensors10 ASE Group. All rights Soc vs ModuleSiPvalue mapping11In many cases, systems are made of a weighted mix of SoC, SiP and SoB ASE Group.

4 All rights Proposing a building block development kit approach12 ASE Group. All rights ASE Group. All rights ASE Group. All rights cost and small size with SiP and advanced MEMS packaging15 ASE Group. All rights Exposed Molding Irregular Molding Selective Molding Double Side MoldingInterconnection Wire Bond Flip Chip Laser DrillingIPDAFEEPSM emoryAPU / MPUMEMS* SESUB is a trademark or registered trademark of TDKC orporation. All other trademarks not owned by ASE that appear in this document are the property of their respective owners, who may or may not be affiliated with, connected to, or sponsored by ASE. 12 Wafer Level Packaging Bumping Fan-Out, Fan-In TSV, TGV IPD3 Embedded Technology a-EASI SESUB (Partner w/ TDK)4 Stacking Die Stacking , 3D (Partner w/ Inotera) PoP, PiP5 System Assembly HD-SMT Flex & Mechanical Assembly6 Shielding / Antenna Conformal Shielding Compartment Shielding AoP(Stamping Antenna) AoP(Lamination Antenna)7 Enabling TechnologiesASE Confidential 25 ASE Group.

5 All rights Technologies -Double Sided Module -Introduction Advantage: Largerdesignspaceandnounderfillrequiredt ofixsubstrateinterposer(SI) DesignFlexibility:FC,WB/StackingonBottom Side Additionalpackagelevelshieldingimplement flexibility, Underfill (MUF)Conventional Double Sided ModuleAdvanced StructureSide ViewSubstrateSISI Top/Bottom ViewUndefillSubstrate InterposerSISIS ubstrateSide View -Type ISISIS ubstrateMold Underfill(MUF)SolderBallSolderBallSide View -Type IIConformal Shielding (Option) 17 ASE Group. All rights mm18 SiPTechnologies -Antenna on Package (AoP)-Provide 40 meter communication range for wearable applicationComponent and Metal Stamped Antenna Pick & PlaceOver Mold or Exposed MoldBLE ChipStamped AntennaAntenna Feed In PointStamped Antenna ASE Group.

6 All rights Technologies -ASE EMI ShieldingSubstrateSide ViewConformal Metal CoatingCompartmentMoldingConformal ShieldingDual Band WiFi/BT ModuleCompartment ShieldingLGA-type WWAN ModuleMolding CompoundMetal CoatingMetal TrenchCuSUSSUS19 Laser Trench TypeMetal Frame Type ASE Group. All rights & Sensors are key enablers for IoTApplication requirements footprint and height reduction Ultra low power & connectivity New needs waterproof solutions rise / emergence of novel sensor clusters (barometer, hygrometry, gas, ) Intelligence sensor hubs and/or sensor fusion with data treatment and autonomous behaviorsPackaging challenges Contradiction:Need to sense the environment but not all the environment. The package is a protection against the environment!

7 The package is a functional filter: it selects what should be let in from what is kept outside How to reduce cost and still keep the package specificity? standardization versus diversity Similarly toSiP: Tool box approach ASE Group. All rights Technologies & BOM selections are key performance differentiatorsInertialEnvironmentalCost effective consumerLow stress Ultra low stressBest formfactorMEMS (G or A)ASICCapMagnetometerMEMSASICMEMS (Acceleroor /and Gyro)Capsensor dieLF or LGAASICASIC ASE Group. All rights and Proximity SensorsALS, Gesture sensors, RGB sensorsUV sensorsClear compression molding with epoxy based mold (LGA or DFN/QFN)Sensor dieClear liquid compression molding with silicone based mold currently not available at ASE(LGA or DFN/QFN)UVASICUVASICC avity mold + cavity filling with silicone gel UVASICP lastic Lid (walls) + silicone gel coating (LGA or DFN/QFN)Sensor dieCavity mold & epoxy fillPALS IR/PROXLEDASIC + photodiodeLGA with CL mold & Plastic Lid -HVMLGA with CL moldVCSELASIC + photodiodesensor die3D WLP cavity wafer moldingIC 3 DWLP sensor stacked on the ASIC (w or wo glass)

8 Sensor dieSensor 3 DWLP TSV-last w or wo glassbiosensor combosLEDphotodiodeICLEDASIC + photodiodeSensorLGA cavity with additional sensorSESUB open cavity with CL moldLEDphotodiodeSensorICSESUB open cavity & clear epoxy filling & sensorLEDphotodiodeICHybrid optical LGA (molded or filled)LEDphotodiodeICCavity OLGA for 1 windowLEDASIC + photodiodeSensorCavityOLGA withglass or thinfilm coverNew HVM 20162017 HVM readiness2018 MatureNote: ** ASE/TDK Joint Venture Trademark ASE Group. All rights and expected benefitsKey benefits: Low noise High sensitivity Low power Small footprint Thinner profile Cost efficiency Optimized sensing (optical, pressure, ) or emitting area (LED) Thermal dissipation enhancement (RF CMOS PA) QFN / LGA platform TSV + WLCSP platformSensorSensor Perfect match to: Faced-up sensing, Faced-down routingEnvironment SensorALS/CIS/Xray/IRIMU, RF ASE Group.

9 All rights with TSV-last benefitsOpen Cavity LGAMold LGAC avity DFNODFNPKGWLPF ootprint25%70%74%30%50%77%Open Cavity LGAMold LGAC avity DFNODFNH eight2 dice solution ASE Group. All rights attach (MEMS or ASIC) to wafer (MEMS or ASIC): WB (tape attach), Au wires FC attach MR or TCB, solder or Cu pillar, NCP, CUF, MUF Receiving wafer w or w/o carrierMolded wafer after die to wafer attachmentWafer Level Molding: Wafer scale molding after either FC or WB (compression molding) CUF & MUFW afer to wafer bonding (device capping): Top wafer: Si, Glass, active die wafer (dev) Bottom wafer: Si Bonding technology: polymer, glass frit On going (dev): metal bonding (solder, eutectic) thin film capping, wafer scale plastic lid (under survey)TSV-last manufacturing capability Temporary or permanent wafer bonding DRIE of TSV last Via isolation & Cu fill Passivation and RDLMEMSMEMSCapASE 3 DWLP availableDevelopmentWBFCW2W cappingTF cappingASE 3 DWLP tool box Passivation, RDl& UBM Ball Attach Laser marking Dicing ASE Group.

10 All rights Application : Body motion and physiological sign sensing in Wearable Services Provided: Module design and manufacturing, system-level testing & firmware co-qualification Technologies Leveraged : Embedded Die Substrate Clear compound molding with micro-structure enhancement Benefit : 84 % module XY size reduction Better optical signal interference isolation Less parasitic resistance & capacitanceSensor Optical HRM PDLEDAFEMCUP assiveLEDNow : Discrete on PCBA Module Size : x x mm Now : Integrated Sensor Module Size : x x mm ASE Confidential ASE Group. All rights bike demonstrator29 ASE Group. All rights reserved.